Inventor · disambiguated record
John Taddei
Also filed as: TADDEI JOHN
21 granted patents·8 pending applications·24 citations·filing 2005–2025
90Inventor score
Files withVEECO PRECISION SURFACE PROC LLC12VEECO INSTR INC10VEECO PREC SURFACE PROC LLC5ITZKOWITZ HERMAN1PRATT CORRUGATED HOLDINGS INC1
Top patents by PatentIndex Score
29 records- 0183US12354503B2Signage fastenerPRATT CORRUGATED HOLDINGS INC·Filed 2023·Granted Jul 8, 2025·1 cites·23 claims
- 0277US10559488B2Two-level tape frame rinse assemblyVEECO PRECISION SURFACE PROC LLC·Filed 2017·Granted Feb 11, 2020·3 cites·14 claims
- 0377US9698062B2System and method for performing a wet etching processVEECO PREC SURFACE PROC LLC·Filed 2013·Granted Jul 4, 2017·6 cites·17 claims
- 0476US9541837B2Apparatus and method for removing challenging polymer films and structures from semiconductor wafersVEECO PREC SURFACE PROC LLC·Filed 2013·Granted Jan 10, 2017·5 cites·20 claims
- 0573US10413850B2Apparatus and method to remove solids from material lift off post process solventsVEECO PRECISION SURFACE PROC LLC·Filed 2018·Granted Sep 17, 2019·3 cites·20 claims
- 0671US11004755B2Apparatus and method for the minimization of undercut during a UBM etch processVEECO INSTR INC·Filed 2019·Granted May 11, 2021·2 cites·25 claims
- 0771US10707099B2Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycleVEECO INSTR INC·Filed 2017·Granted Jul 7, 2020·2 cites·23 claims
- 0868US2025328079A1Uv assisted strip (uvas) of photoresist to realize esg and 3d integration targetsVEECO INSTR INC·Filed 2025·Application pending·0 cites
- 0967US10553502B2Two etch method for achieving a wafer thickness profileVEECO PRECISION SURFACE PROC LLC·Filed 2018·Granted Feb 4, 2020·1 cites·17 claims
- 1065US11342215B2Semiconductor wafer processing chamberVEECO INSTR INC·Filed 2018·Granted May 24, 2022·1 cites·26 claims
- 1157US2019168178A1Apparatus and Method for Mixing Fluids with Degradational PropertiesVEECO PRECISION SURFACE PROC LLC·Filed 2019·Application pending·0 cites
- 1253US2025323068A1Apparatus for improved material lift off (mlo)semiconductor processingVEECO INSTR INC·Filed 2025·Application pending·0 cites
- 1351US10239031B2Apparatus and method for mixing fluids with degradational propertiesVEECO PRECISION SURFACE PROC LLC·Filed 2016·Granted Mar 26, 2019·0 cites·18 claims
- 1451US2025323065A1Apparatus for semiconductor solvent processing utilized for 3d and traditional process flowsVEECO INSTR INC·Filed 2025·Application pending·0 cites
- 1548US9694436B2System and method for flux coat, reflow and cleanVEECO PREC SURFACE PROC LLC·Filed 2014·Granted Jul 4, 2017·0 cites·17 claims
- 1647US11756805B2Apparatus and method for die stack flux removalVEECO INSTR INC·Filed 2020·Granted Sep 12, 2023·0 cites·20 claims
- 1747US10294132B2Apparatus and method to reduce and control resistivity of deionized waterVEECO PRECISION SURFACE PROC LLC·Filed 2015·Granted May 21, 2019·0 cites·19 claims
- 1846US9333446B2Apparatus and method to remove undissolved solids from post process dry film strip solventsVEECO PREC SURFACE PROC LLC·Filed 2013·Granted May 10, 2016·0 cites·21 claims
- 1944US10026660B2Method of etching the back of a wafer to expose TSVsVEECO PRECISION SURFACE PROC LLC·Filed 2015·Granted Jul 17, 2018·0 cites·32 claims
- 2043US10443943B2Apparatus and method to control properties of fluid discharge via refrigerative exhaustVEECO PRECISION SURFACE PROC LLC·Filed 2017·Granted Oct 15, 2019·0 cites·16 claims
- 2142US10503182B2Apparatus and method for metals free reduction and control of resistivity of deionized waterVEECO PRECISION SURFACE PROC LLC·Filed 2015·Granted Dec 10, 2019·0 cites·24 claims
- 2241US10541180B2Apparatus and method for wafer thinning in advanced packaging applicationsVEECO PRECISION SURFACE PROC LLC·Filed 2018·Granted Jan 21, 2020·0 cites·31 claims
- 2340US2020161146A1Semiconductor wafer processing chamberVEECO INSTR INC·Filed 2019·Application pending·0 cites
- 2439US11069583B2Apparatus and method for the minimization of undercut during a UBM etch processVEECO INSTR INC·Filed 2019·Granted Jul 20, 2021·0 cites·21 claims
- 2538US2006172538A1Wet etching the edge and bevel of a silicon waferITZKOWITZ HERMAN·Filed 2005·Application pending·0 cites
- 2637US11232958B2System and method for self-cleaning wet treatment processVEECO INSTR INC·Filed 2019·Granted Jan 25, 2022·0 cites·26 claims
- 2735US10446387B2Apparatus and method to control etch rate through adaptive spiking of chemistryVEECO PRECISION SURFACE PROC LLC·Filed 2017·Granted Oct 15, 2019·0 cites·23 claims
- 2834US2017287768A1Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving ProcessVEECO PREC SURFACE PROC LLC·Filed 2017·Application pending·0 cites
- 2934US2018308741A1Configurable high temperature chuck for use in a semiconductor wafer processing systemVEECO PRECISION SURFACE PROC LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →