Inventor · disambiguated record
Joon Shyan Tan
Also filed as: TAN JOON SHYAN
1 granted patent·3 pending applications·0 citations·filing 2023–2025
5Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0156US2025201754A1Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between themINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0256US2024312936A1Power semiconductor package including a passive electronic component and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0354US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 0449US2025357232A1Semiconductor package including an encapsulant with a peripheral side wall having a recess and a lead disposed in the recessINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →