Inventor · disambiguated record
John Tang
Also filed as: TANG JOHN · TANG JOHN J · TANG JOHN JINGAN
10 granted patents·2 pending applications·283 citations·filing 2001–2022
89Inventor score
Top patents by PatentIndex Score
12 records- 0194US6888240B2High performance, low cost microelectronic circuit package with interposerINTEL CORP·Filed 2001·Granted May 3, 2005·146 cites·38 claims
- 0292US7183658B2Low cost microelectronic circuit packageINTEL CORP·Filed 2001·Granted Feb 27, 2007·84 cites·47 claims
- 0386US7435664B2Wafer-level bonding for mechanically reinforced ultra-thin dieINTEL CORP·Filed 2006·Granted Oct 14, 2008·12 cites·9 claims
- 0481US7511359B2Dual die package with high-speed interconnectINTEL CORP·Filed 2005·Granted Mar 31, 2009·11 cites·10 claims
- 0577US6803649B1Electronic assemblyINTEL CORP·Filed 2003·Granted Oct 12, 2004·21 cites·20 claims
- 0657US7405364B2Decoupled signal-power substrate architectureINTEL CORP·Filed 2002·Granted Jul 29, 2008·6 cites·18 claims
- 0751US7989916B2Integrated capacitors in package-level structures, processes of making same, and systems containing sameINTEL CORP·Filed 2009·Granted Aug 2, 2011·0 cites·22 claims
- 0851US2008265407A1Wafer-level bonding for mechanically reinforced ultra-thin dieINTEL CORP·Filed 2008·Application pending·0 cites
- 0948US7714432B2Ceramic/organic hybrid substrateINTEL CORP·Filed 2002·Granted May 11, 2010·3 cites·14 claims
- 1048US2023186602A1Systems and methods for automatically detecting substances in medical imagingSTRYKER CORP·Filed 2022·Application pending·0 cites
- 1144US7670919B2Integrated capacitors in package-level structures, processes of making same, and systems containing sameINTEL CORP·Filed 2005·Granted Mar 2, 2010·0 cites·19 claims
- 1241US7981726B2Copper plating connection for multi-die stack in substrate packageINTEL CORP·Filed 2005·Granted Jul 19, 2011·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →