Inventor · disambiguated record
Jochen Thomas
Also filed as: THOMAS JOCHEN
19 granted patents·4 pending applications·654 citations·filing 2000–2008
95Inventor score
Files withINFINEON TECHNOLOGIES AG14HETZEL WOLFGANG2QIMONDA AG2FRAUNHOFER GES FORSCHUNG1SIMON JUERGEN1
Top patents by PatentIndex Score
23 records- 0196US7297574B2Multi-chip device and method for producing a multi-chip deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 20, 2007·336 cites·23 claims
- 0289US6894381B2Electronic device having a stack of semiconductor chips and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 17, 2005·68 cites·18 claims
- 0388US7402911B2Multi-chip device and method for producing a multi-chip deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 22, 2008·19 cites·13 claims
- 0488US7352057B2Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 1, 2008·25 cites·9 claims
- 0587US7456505B2Integrated circuit chip and integrated deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Nov 25, 2008·25 cites·12 claims
- 0686US7948071B2Integrated circuit with re-route layer and stacked die assemblyQIMONDA AG·Filed 2008·Granted May 24, 2011·13 cites·44 claims
- 0781US6927484B2Stack arrangement of a memory moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 9, 2005·31 cites·33 claims
- 0879US7422930B2Integrated circuit with re-route layer and stacked die assemblyINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 9, 2008·25 cites·60 claims
- 0976US6768191B2Electronic component with stacked electronic elementsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 27, 2004·24 cites·18 claims
- 1075US7253514B2Self-supporting connecting element for a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 7, 2007·7 cites·16 claims
- 1171US8624372B2Semiconductor component comprising an interposer substrateHETZEL WOLFGANG·Filed 2006·Granted Jan 7, 2014·6 cites·19 claims
- 1270US7294910B2Electronic component with multilayered rewiring plate and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 13, 2007·16 cites·28 claims
- 1366US6977427B2Electronic component having stacked semiconductor chips in parallel, and a method for producing the componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 20, 2005·14 cites·10 claims
- 1464US6536682B1Actuator component for a microspray and its production processFRAUNHOFER GES FORSCHUNG·Filed 2000·Granted Mar 25, 2003·16 cites·14 claims
- 1561US7198979B2Method for manufacturing a stack arrangement of a memory moduleINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 3, 2007·10 cites·27 claims
- 1652US7851899B2Multi-chip ball grid array package and method of manufactureUTAC UNITED TEST AND ASSEMBLY TEST CT LTD·Filed 2004·Granted Dec 14, 2010·10 cites·14 claims
- 1750US7023097B2FBGA arrangementINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 4, 2006·5 cites·23 claims
- 1848US7345363B2Semiconductor device with a rewiring level and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 18, 2008·1 cites·12 claims
- 1946US8072085B2Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the sameHETZEL WOLFGANG·Filed 2004·Granted Dec 6, 2011·3 cites·16 claims
- 2041US2008203581A1Integrated circuitQIMONDA AG·Filed 2007·Application pending·0 cites
- 2139US2008079150A1Die arrangement and method for producing a die arrangementSIMON JUERGEN·Filed 2006·Application pending·0 cites
- 2238US2007090527A1Integrated chip device in a packageTHOMAS JOCHEN·Filed 2005·Application pending·0 cites
- 2333US2007210433A1Integrated device having a plurality of chip arrangements and method for producing the sameSUBRAYA RAJESH·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →