Inventor · disambiguated record
John Timmerman
Also filed as: TIMMERMAN JOHN · TIMMERMAN JOHN FRANCIS
5 granted patents·6 pending applications·16 citations·filing 2008–2025
73Inventor score
Top patents by PatentIndex Score
11 records- 0184US9611414B2Thermal interface material with mixed aspect ratio particle dispersionsHenkel IP & Holding GmbH·Filed 2014·Granted Apr 4, 2017·6 cites·13 claims
- 0274US9693481B2Thermally conductive dielectric interfaceHenkel IP & Holding GmbH·Filed 2014·Granted Jun 27, 2017·6 cites·14 claims
- 0373US9999158B2Thermally conductive EMI suppression compositionsHenkel IP & Holding GmbH·Filed 2013·Granted Jun 12, 2018·4 cites·10 claims
- 0465US12441881B2Thermal interface materialsHENKEL AG & CO KGAA·Filed 2021·Granted Oct 14, 2025·0 cites·15 claims
- 0562US2022328902A1Silicone free thermal interface material with reactive diluentHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0658US11447677B2Thermal interface material with mixed aspect ratio particle dispersionsHenkel IP & Holding GmbH·Filed 2019·Granted Sep 20, 2022·0 cites·18 claims
- 0755US2024279426A1Non-silicone thermal interface materialHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0855US2009208722A1Oriented Members for Thermally Conductive Interface StructuresTIMMERMAN JOHN FRANCIS·Filed 2008·Application pending·0 cites
- 0949US2025215303A1Epoxy-based composition for thermal interface materialsHENKEL AG & CO KGAA·Filed 2025·Application pending·0 cites
- 1049US2017158936A1Thermal Interface Material with Mixed Aspect Ratio Particle DispersionsHenkel IP & Holding GmbH·Filed 2017·Application pending·0 cites
- 1136US2013042972A1Dual Cure Thermally Conductive AdhesiveTIMMERMAN JOHN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →