Inventor · disambiguated record
Johnson Tzu
Also filed as: TZU JOHNSON C H
0 granted patents·4 pending applications·0 citations·filing 2001–2001
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0131US2002144840A1Leadframe package with dummy chipFiled 2001·Application pending·0 cites
- 0226US2002145186A1Method of forming HSQFN type packageFiled 2001·Application pending·0 cites
- 0317US2003038380A1Apparatus for packing semiconductor dieFiled 2001·Application pending·0 cites
- 0416US2002192854A1Method for packing semiconductor dieFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →