Inventor · disambiguated record
Joseph Van Nausdle
Also filed as: VAN NAUSDLE JOSEPH · VAN NAUSDLE JOSEPH ALLEN
2 granted patents·4 pending applications·1 citations·filing 2020–2024
33Inventor score
Technology areasH10W
Files withINTEL CORP6
Top patents by PatentIndex Score
6 records- 0177US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 0269US2024402445A1Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2024·Application pending·0 cites
- 0362US12130482B2Hydrophobic feature to control adhesive flowINTEL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·19 claims
- 0457US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 0556US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0643US2022102231A1Dummy die in a recessed mold structure of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →