Inventor · disambiguated record

John Vesce, Iii

Also filed as: VESCE III JOHN · VESCE JOHN

2 granted patents·0 citations·filing 2013–2020

23Inventor score

Technology areasH05K

Files withTTM TECH INC2

Top patents by PatentIndex Score

2 records

0148US11277909B2Three-dimensional circuit assembly with composite bonded encapsulationTTM TECH INC·Filed 2020·Granted Mar 15, 2022·0 cites·11 claims
0234US9532465B2Method of fabricating a printed circuit board interconnect assemblyTTM TECH INC·Filed 2013·Granted Dec 27, 2016·0 cites·1 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →