Inventor · disambiguated record
Joe Walczyk
Also filed as: WALCZYK JOE · WALCZYK JOE F
30 granted patents·9 pending applications·30 citations·filing 2012–2024
94Inventor score
Top patents by PatentIndex Score
39 records- 0192US11372023B2Slip-plane MEMs probe for high-density and fine pitch interconnectsINTEL CORP·Filed 2021·Granted Jun 28, 2022·2 cites·20 claims
- 0287US10935573B2Slip-plane MEMS probe for high-density and fine pitch interconnectsINTEL CORP·Filed 2018·Granted Mar 2, 2021·4 cites·18 claims
- 0384US11948906B2Hybrid backside thermal structures for enhanced IC packagesINTEL CORP·Filed 2020·Granted Apr 2, 2024·2 cites·25 claims
- 0482US10877068B2High density and fine pitch interconnect structures in an electric test apparatusINTEL CORP·Filed 2019·Granted Dec 29, 2020·2 cites·20 claims
- 0582US9046569B2Seal method for direct liquid cooling of probes used at first level interconnectKIRBY RONALD·Filed 2012·Granted Jun 2, 2015·9 cites·23 claims
- 0677US9523713B2Interconnects including liquid metalINTEL CORP·Filed 2013·Granted Dec 20, 2016·5 cites·16 claims
- 0775US10566263B2Conformable heat spreaderINTEL CORP·Filed 2017·Granted Feb 18, 2020·1 cites·25 claims
- 0875US2025020874A1Stackable photonics die with direct optical interconnectINTEL CORP·Filed 2024·Application pending·0 cites
- 0974US12482779B2Hybrid backside thermal structures for enhanced ic packagesINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·20 claims
- 1074US11073538B2Electrical testing apparatus with lateral movement of a probe support substrateINTEL CORP·Filed 2018·Granted Jul 27, 2021·1 cites·19 claims
- 1171US11249113B2High density and fine pitch interconnect structures in an electric test apparatusINTEL CORP·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 1267US10338099B2Low profile edge clamp socketINTEL CORP·Filed 2017·Granted Jul 2, 2019·1 cites·16 claims
- 1364US12135460B2Stackable photonics die with direct optical interconnectINTEL CORP·Filed 2020·Granted Nov 5, 2024·0 cites·22 claims
- 1460US9674943B2Actuation mechanisms for electrical interconnectionsINTEL CORP·Filed 2012·Granted Jun 6, 2017·1 cites·8 claims
- 1558US12061230B2Active optical plug to optically or electrically test a photonics packageINTEL CORP·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
- 1658US10488438B2High density and fine pitch interconnect structures in an electric test apparatusINTEL CORP·Filed 2018·Granted Nov 26, 2019·0 cites·20 claims
- 1758US2025293137A13d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 1856US12341281B2Micro socket electrical couplings for diesINTEL CORP·Filed 2020·Granted Jun 24, 2025·0 cites·18 claims
- 1956US12136577B2Integrated circuit die packages including a contiguous heat spreaderINTEL CORP·Filed 2020·Granted Nov 5, 2024·0 cites·22 claims
- 2056US10644458B2Shielded interconnect arrayINTEL CORP·Filed 2017·Granted May 5, 2020·1 cites·10 claims
- 2153US12087658B2Hybrid thermal interface material (TIM) with reduced 3D thermal resistanceINTEL CORP·Filed 2020·Granted Sep 10, 2024·0 cites·16 claims
- 2252US11656247B2Micro-coaxial wire interconnect architectureINTEL CORP·Filed 2017·Granted May 23, 2023·0 cites·25 claims
- 2352US2017273176A1Actuation mechanisms for electrical interconnectionsINTEL CORP·Filed 2017·Application pending·0 cites
- 2451US12080620B2Additively manufactured structures for heat dissipation from integrated circuit devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 2551US12009612B2Dual-sided socket device with corrugation structures and shield structuresINTEL CORP·Filed 2020·Granted Jun 11, 2024·0 cites·20 claims
- 2651US11398414B2Sloped metal features for cooling hotspots in stacked-die packagesINTEL CORP·Filed 2018·Granted Jul 26, 2022·0 cites·11 claims
- 2750US11935860B2Electrical connector with insulated conductive layerINTEL CORP·Filed 2020·Granted Mar 19, 2024·0 cites·9 claims
- 2850US11592472B2Thermal switch for rapid thermal coupling and decoupling of devices under testINTEL CORP·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 2950US9128121B2Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical pathsFLEDELL EVAN M·Filed 2012·Granted Sep 8, 2015·1 cites·18 claims
- 3047US2022196924A1Pierceable protective cover for photonic connectorsINTEL CORP·Filed 2020·Application pending·0 cites
- 3145US11581237B2Cooling apparatuses for microelectronic assembliesINTEL CORP·Filed 2018·Granted Feb 14, 2023·0 cites·13 claims
- 3245US9581639B2Organic space transformer attachment and assemblyYANG JIN·Filed 2013·Granted Feb 28, 2017·0 cites·21 claims
- 3343US2020411408A1Deflected-pillar composite compliant elongated micro-structure thermal interface materialsINTEL CORP·Filed 2019·Application pending·0 cites
- 3442US10324112B2Package testing system and method with contact alignmentINTEL CORP·Filed 2016·Granted Jun 18, 2019·0 cites·18 claims
- 3540US2014262129A1Thermal control of device using fluid coolantLI ZHIHUA·Filed 2013·Application pending·0 cites
- 3639US2020072871A1Ultra low-cost, low leadtime, and high density space transformer for fine pitch applicationsINTEL CORP·Filed 2017·Application pending·0 cites
- 3738US2014139247A1Interposer apparatus and methodsOH YOUNGSEOK·Filed 2012·Application pending·0 cites
- 3837US2013337666A1Substrate embedded electrical interconnectWALCZYK JOE F·Filed 2012·Application pending·0 cites
- 3934US11639556B2Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arraysINTEL CORP·Filed 2017·Granted May 2, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →