Inventor · disambiguated record
Jones Wang
Also filed as: WANG CHUNG YU JONES · WANG JONES
9 granted patents·1 pending application·375 citations·filing 2001–2014
90Inventor score
Top patents by PatentIndex Score
10 records- 0196US6656827B1Electrical performance enhanced wafer level chip scale package with groundTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 2, 2003·142 cites·20 claims
- 0293US6607942B1Method of fabricating as grooved heat spreader for stress reduction in an IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 19, 2003·75 cites·12 claims
- 0392US9754849B2Organic-inorganic hybrid structure for integrated circuit packagesINTEL CORP·Filed 2014·Granted Sep 5, 2017·37 cites·17 claims
- 0492US6939789B2Method of wafer level chip scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 6, 2005·84 cites·28 claims
- 0569US6638837B1Method for protecting the front side of semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 28, 2003·12 cites·14 claims
- 0666US6960518B1Buildup substrate pad pre-solder bump manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 1, 2005·12 cites·6 claims
- 0765US7015066B2Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Mar 21, 2006·11 cites·13 claims
- 0847US7390697B2Enhanced adhesion strength between mold resin and polyimideTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 24, 2008·0 cites·14 claims
- 0947US6884662B1Enhanced adhesion strength between mold resin and polyimideTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 26, 2005·2 cites·17 claims
- 1038US2003176020A1Grooved heat spreader for stress reduction in IC packageFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →