Inventor · disambiguated record
Joy Watanabe
Also filed as: WATANABE JOY · WATANABE JOY KIMI
6 granted patents·1 pending application·168 citations·filing 1998–2025
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0198US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 0298US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 0397US12272677B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Apr 8, 2025·3 cites·21 claims
- 0481US2025266401A1Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0580US6127258AMethod for forming a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Oct 3, 2000·55 cites·20 claims
- 0676US6043146AProcess for forming a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Mar 28, 2000·50 cites·18 claims
- 0768US6372665B1Method for forming a semiconductor deviceMOTOROLA INC·Filed 2000·Granted Apr 16, 2002·13 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →