Inventor · disambiguated record
Jooi Wah Wong
Also filed as: WONG JOOI WAH
0 granted patents·12 pending applications·0 citations·filing 2022–2022
Technology areasH10W
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0153US2024106139A1Connector to electrically couple multiple substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 0247US2024234303A9Integrated inductor over transistor layerINTEL CORP·Filed 2022·Application pending·0 cites
- 0347US2024234234A9Copper fill for heat management in integrated circuit deviceINTEL CORP·Filed 2022·Application pending·0 cites
- 0446US2023395578A1Memory package on extended base die over soc die for package layer count and form factor reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 0546US2023420354A1Electrical conductor extending from a surface of a substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 0646US2023420384A1Slotted stiffener for a package substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 0746US2023395576A1Memory on package (mop) architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 0846US2023420350A1Hyper density package substrate and memory coupled to a modified semi-additive process boardINTEL CORP·Filed 2022·Application pending·0 cites
- 0946US2023395493A1On package interconnect architecture for high-speed memoryINTEL CORP·Filed 2022·Application pending·0 cites
- 1046US2023420345A1Copper rings for bga count reduction in small form factor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1146US2023395577A1Soc-memory integration to achieve smallest and thinnest memory on package architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1246US2023397333A1Ultra-laser though hole (ulth) by multi-stacked core conceptINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →