Inventor · disambiguated record
Joachim Wuerfl
Also filed as: WUERFL JOACHIM
3 granted patents·7 citations·filing 2006–2010
57Inventor score
Top patents by PatentIndex Score
3 records- 0160US8866191B2HEMT semiconductor component with field platesBAHAT-TREIDEL ELDAT·Filed 2008·Granted Oct 21, 2014·6 cites·6 claims
- 0246US8648466B2Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact padSIDOROV VICTOR·Filed 2010·Granted Feb 11, 2014·1 cites·17 claims
- 0331US8455355B2Method for producing through-contacts in semi-conductor wafers via production of through-plated holesKRUEGER OLAF·Filed 2006·Granted Jun 4, 2013·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →