Inventor · disambiguated record
John Y. Xie
Also filed as: XIE JOHN Y · XIE JOHN YUANLIN
7 granted patents·845 citations·filing 1995–2004
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0196US6034427ABall grid array structure and method for packaging an integrated circuit chipPROLINX LABS CORP·Filed 1998·Granted Mar 7, 2000·294 cites·41 claims
- 0294US5906042AMethod and structure to interconnect traces of two conductive layers in a printed circuit boardPROLINX LABS CORP·Filed 1995·Granted May 25, 1999·203 cites·30 claims
- 0392US5872338AMultilayer board having insulating isolation ringsPROLINX LABS CORP·Filed 1996·Granted Feb 16, 1999·125 cites·20 claims
- 0484US5834824AUse of conductive particles in a nonconductive body as an integrated circuit antifusePROLINX LABS CORP·Filed 1995·Granted Nov 10, 1998·81 cites·10 claims
- 0584US5767575ABall grid array structure and method for packaging an integrated circuit chipPROLINX LABS CORP·Filed 1995·Granted Jun 16, 1998·82 cites·38 claims
- 0680US5987744AMethod for supporting one or more electronic componentsPROLINX LABS CORP·Filed 1997·Granted Nov 23, 1999·54 cites·8 claims
- 0753US7276399B1Method of designing a module-based flip chip substrate designALTERA CORP·Filed 2004·Granted Oct 2, 2007·6 cites·28 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →