Inventor · disambiguated record
Jong Seong Yim
Also filed as: YIM JONG SEONG
2 granted patents·1 pending application·0 citations·filing 2016–2021
23Inventor score
Top patents by PatentIndex Score
3 records- 0160US2024301202A1Polycarbonate resin composition for 3d printing having excellent shape retention ability and interfacial adhesion, and pellet and filament for 3d printing comprising sameSAMYANG CORP·Filed 2021·Application pending·0 cites
- 0253US12122910B2Polycarbonate resin composition for 3D printing and 3D printing filament comprising sameSAMYANG CORP·Filed 2019·Granted Oct 22, 2024·0 cites·4 claims
- 0337US10888839B2Average-density-adjustable structure, and material change and selective bonding process using sameUNIV KOREA RES & BUS FOUND·Filed 2016·Granted Jan 12, 2021·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →