Inventor · disambiguated record
Jong Wook Yun
Also filed as: YUN JONG WOOK
21 granted patents·15 pending applications·5 citations·filing 2015–2024
88Inventor score
Top patents by PatentIndex Score
36 records- 0184US11534888B2Polishing pad with improved fluidity of slurry and process for preparing sameSKC SOLMICS CO LTD·Filed 2019·Granted Dec 27, 2022·2 cites·11 claims
- 0280US11207757B2Composition for polishing pad, polishing pad and preparation method of semiconductor deviceSKC SOLMICS CO LTD·Filed 2020·Granted Dec 28, 2021·1 cites·20 claims
- 0372US11279825B2Composition for polishing pad, polishing pad and preparation method thereofSKC SOLMICS CO LTD·Filed 2019·Granted Mar 22, 2022·1 cites·13 claims
- 0469US11766759B2Porous polyurethane polishing pad and process for producing the sameSK ENPULSE CO LTD·Filed 2019·Granted Sep 26, 2023·1 cites·14 claims
- 0563US2024066661A1Method for manufacturing a polishing sheet and a polishing padSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 0662US12122013B2Composition for polishing pad and polishing padSK ENPULSE CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·13 claims
- 0762US2022203496A1Polishing pad, manufacturing method thereof, method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2021·Application pending·0 cites
- 0859US11267098B2Leakage-proof polishing pad and process for preparing the sameSKC SOLMICS CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·21 claims
- 0958US11534887B2Polishing pad and method for preparing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2021·Granted Dec 27, 2022·0 cites·14 claims
- 1056US2023339072A1Conditioning device and method for controlling the conditioning deviceSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 1155US11400559B2Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 1255US2024300066A1Polishing pad and preparing method of semiconductor deviceSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1354US11548970B2Composition for a polishing pad, polishing pad, and process for preparing the sameSKC SOLMICS CO LTD·Filed 2019·Granted Jan 10, 2023·0 cites·20 claims
- 1453US12076832B2Polishing pad with improved crosslinking density and process for preparing the sameSKC SOLMICS CO LTD·Filed 2020·Granted Sep 3, 2024·0 cites·10 claims
- 1553US2024308022A1Polishing pad and preparation method thereofSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1653US2023330806A1Polishing pad with improved wettability and method for preparing sameSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 1751US2022355436A1Polishing pad, method for manufacturing the same, and method for manufacturing semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1851US2023047113A1Polishing device and method for manufacturing semiconductor deviceSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1951US2024342857A1Polishing pad with adjusted content of chlorine and process for preparing semiconductor device using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 2049US12162114B2Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·17 claims
- 2149US11951591B2Polishing pad, method for producing the same and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·10 claims
- 2249US2022288743A1Polishing pad, method for producing the same and method of fabricating semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 2349US2023059394A1Polishing pad and method for manufacturing semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 2449US2023197482A1Polishing pad and method for manufacturing semiconductor device using sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 2549US2022097197A1Polishing pad and method of fabricating semiconductor device using the sameSKC SOLMICS CO LTD·Filed 2021·Application pending·0 cites
- 2648US12246408B2Polishing pad and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·15 claims
- 2748US11628535B2Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing padSKC SOLMICS CO LTD·Filed 2019·Granted Apr 18, 2023·0 cites·17 claims
- 2847US12258460B2Polishing pad and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Mar 25, 2025·0 cites·10 claims
- 2946US11000935B2Polishing pad that minimizes occurrence of defects and process for preparing the sameSKC SOLMICS CO LTD·Filed 2020·Granted May 11, 2021·0 cites·12 claims
- 3045US12362232B2Polishing pad and method for preparing semiconductor device using the sameSK ENPULSE CO LTD·Filed 2021·Granted Jul 15, 2025·0 cites·15 claims
- 3145US11571783B2Polishing pad having excellent airtightnessSKC SOLMICS CO LTD·Filed 2018·Granted Feb 7, 2023·0 cites·9 claims
- 3245US10239986B2Highly elastic polyester modified urethane resin and clear coat composition containing sameKCC CORP·Filed 2015·Granted Mar 26, 2019·0 cites·11 claims
- 3343US2021154797A1Polishing pad, preparation method thereof, and preparation method of semiconductor device using sameSKC CO LTD·Filed 2020·Application pending·0 cites
- 3443US2021138605A1Polishing pad, preparation method thereof, and preparation method of semiconductor device using sameSKC CO LTD·Filed 2020·Application pending·0 cites
- 3542US12479063B2Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing padENPULSE CO LTD·Filed 2019·Granted Nov 25, 2025·0 cites·9 claims
- 3641US11772236B2Porous polishing pad and process for producing the same all feesSK ENPULSE CO LTD·Filed 2019·Granted Oct 3, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →