Inventor · disambiguated record
Jörg Zapf
Also filed as: ZAPF JOERG · ZAPF JORG · ZAPF JÖRG
27 granted patents·7 pending applications·140 citations·filing 2001–2022
95Inventor score
Top patents by PatentIndex Score
34 records- 0174US6852931B2Configuration having an electronic device electrically connected to a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 8, 2005·19 cites·27 claims
- 0273US7905000B2Piezoceramic multilayer actuator and method for the production thereofSIEMENS AG·Filed 2008·Granted Mar 15, 2011·9 cites·6 claims
- 0373US7208347B2Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contoursSIEMENS AG·Filed 2004·Granted Apr 24, 2007·18 cites·16 claims
- 0467US7402457B2Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfacesSIEMENS AG·Filed 2002·Granted Jul 22, 2008·18 cites·16 claims
- 0566US9134390B2Magnetic resonance local coilEVERS DANIEL·Filed 2012·Granted Sep 15, 2015·2 cites·21 claims
- 0666US7851978B2Piezo actuator comprising a multilayer encapsulation, and method for the production thereofSIEMENS AG·Filed 2007·Granted Dec 14, 2010·4 cites·9 claims
- 0764US12027991B2Rectifier and power supply deviceSIEMENS AG·Filed 2021·Granted Jul 2, 2024·0 cites·10 claims
- 0863US8487257B2Device with a sandwich structure for detecting thermal radiation, and method for the production thereofGIEBELER CARSTEN·Filed 2008·Granted Jul 16, 2013·4 cites·20 claims
- 0963US8258677B2Piezoelectric component with directly structured external contacting, method for manufacturing the component and use of said componentDENNELER STEFAN·Filed 2009·Granted Sep 4, 2012·4 cites·16 claims
- 1060US7368324B2Method of manufacturing self-supporting contacting structuresSIEMENS AG·Filed 2004·Granted May 6, 2008·10 cites·21 claims
- 1160US7340826B2Method for producing an electronic device connected to a printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2004·Granted Mar 11, 2008·8 cites·16 claims
- 1259US7483275B2Electronic unit, circuit design for the same, and production methodPOLYIC GMBH & CO KG·Filed 2002·Granted Jan 27, 2009·9 cites·9 claims
- 1358US7274102B2Contacting device, testing method and corresponding production methodINFINEON TECHNOLOGIES AG·Filed 2006·Granted Sep 25, 2007·1 cites·9 claims
- 1458US6481294B2Sensor array for a capacitance measuring fingerprint sensor, and method for producing such a sensor arrayINFINEON TECHNOLOGIES AG·Filed 2001·Granted Nov 19, 2002·19 cites·9 claims
- 1555US7427532B2Method of manufacturing a device having a contacting structureSIEMENS AG·Filed 2004·Granted Sep 23, 2008·7 cites·20 claims
- 1654US7759754B2Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modulesOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2004·Granted Jul 20, 2010·6 cites·19 claims
- 1753US12082333B2Electronic module, method for producing an electronic module, and industrial plantSIEMENS AG·Filed 2021·Granted Sep 3, 2024·0 cites·9 claims
- 1852US11181408B2Thermoresistive gas sensorSIEMENS AG·Filed 2019·Granted Nov 23, 2021·0 cites·13 claims
- 1951US8106566B2Piezoelectric component with outer contacting, having gas-phase deposition, method for manufacturing component and use of componentDENNELER STEFAN·Filed 2008·Granted Jan 31, 2012·1 cites·20 claims
- 2048US7855451B2Device having a contacting structureSIEMENS AG·Filed 2007·Granted Dec 21, 2010·0 cites·13 claims
- 2144US9506831B2Micromechanical measuring element and method for producing a micromechanical measuring elementEPCOS AG·Filed 2013·Granted Nov 29, 2016·0 cites·15 claims
- 2244US2005031490A1Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewithFiled 2002·Application pending·0 cites
- 2343US2024150166A1Encapsulated MEMS Switching Element, Device and Production MethodSIEMENS AG·Filed 2022·Application pending·0 cites
- 2441US9170226B2Micromechanical substrate for a diaphragm with a diffusion barrier layerFLEISCHER MAXIMILIAN·Filed 2011·Granted Oct 27, 2015·0 cites·10 claims
- 2541US7807931B2Electrical component on a substrate and method for production thereofSIEMENS AG·Filed 2004·Granted Oct 5, 2010·1 cites·4 claims
- 2638US9364863B2Method for forming an ultrasound transducer arraySTEGMEIER STEFAN·Filed 2013·Granted Jun 14, 2016·0 cites·15 claims
- 2738US2014084428A1Integrated circuit with electrical through-contact and method for producing electrical through-contactHEDLER HARRY·Filed 2012·Application pending·0 cites
- 2836US9884759B2Thermoelement including a three-dimensional microstructure, and method for producing a thermoelementHEDLER HARRY·Filed 2010·Granted Feb 6, 2018·0 cites·16 claims
- 2936US2012180839A1Thermo-electric energy converter having a three-dimensional micro-structure, method for producing the energy converter and use of the energy converterHEDLER HARRY·Filed 2010·Application pending·0 cites
- 3036US2005151249A1Chip-size package with an integrated passive componentFiled 2003·Application pending·0 cites
- 3136US2017189882A1Preconcentrator for absorbing/desorbing at least one component of gasSIEMENS AG·Filed 2015·Application pending·0 cites
- 3235US8261439B2Method for contacting electronic components by means of a substrate plateKALTENBACHER AXEL·Filed 2008·Granted Sep 11, 2012·0 cites·9 claims
- 3333US9999120B2Circuit carrier having a conducting path and an electric shieldPOPRAWA FLORIAN·Filed 2012·Granted Jun 12, 2018·0 cites·12 claims
- 3433US2006267135A1Circuit arrangement placed on a substrate and method for producing the sameWOLFGANG ECKHARD·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →