Inventor · disambiguated record
Joseph Edward Zdimal
Also filed as: ZDIMAL JOSEPH E · ZDIMAL JOSEPH EDWARD
4 granted patents·155 citations·filing 1995–2000
76Inventor score
Files withIBM4
Top patents by PatentIndex Score
4 records- 0190US5542601ARework process for semiconductor chips mounted in a flip chip configuration on an organic substrateIBM·Filed 1995·Granted Aug 6, 1996·145 cites·10 claims
- 0246US6223968B1Solder bonding/debonding nozzle insertIBM·Filed 2000·Granted May 1, 2001·2 cites·4 claims
- 0339US5810241ASolder bonding/debonding nozzle insertIBM·Filed 1996·Granted Sep 22, 1998·7 cites·9 claims
- 0427US6082608ASolder bonding/debonding nozzle insertIBM·Filed 1998·Granted Jul 4, 2000·1 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →