Inventor · disambiguated record
Jungseok Ahn
Also filed as: AHN JUNGSEOK
1 granted patent·6 pending applications·2 citations·filing 2020–2025
19Inventor score
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0186US11705323B2Wafer trimming deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 0273US2025379192A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0360US2023029098A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0447US2024063186A1Semiconductor package including stacked chips and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0544US2023130983A1Semiconductor device, semiconductor package, and method of fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0641US2024006382A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0739US2023075665A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →