Inventor · disambiguated record
Juergen Bednarz
Also filed as: BEDNARZ JUERGEN
3 granted patents·149 citations·filing 1989–1992
75Inventor score
Files withSIEMENS AG3
Top patents by PatentIndex Score
3 records- 0193US5008496AThree-dimensional printed circuit boardSIEMENS AG·Filed 1989·Granted Apr 16, 1991·122 cites·20 claims
- 0251US5106785AMethod for encapsulating electronic components or assemblies using a thermoplastic encapsulantSIEMENS AG·Filed 1990·Granted Apr 21, 1992·14 cites·11 claims
- 0347US5376824AMethod and an encapsulation for encapsulating electrical or electronic components or assembliesSIEMENS AG·Filed 1992·Granted Dec 27, 1994·13 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →