Inventor · disambiguated record
Julie C. Biggs
Also filed as: BIGGS JULIE C
4 granted patents·13 citations·filing 2003–2009
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0172US7473997B2Method for forming robust solder interconnect structures by reducing effects of seed layer underetchingIBM·Filed 2005·Granted Jan 6, 2009·4 cites·10 claims
- 0262US6995475B2I/C chip suitable for wire bondingIBM·Filed 2003·Granted Feb 7, 2006·9 cites·3 claims
- 0346US7572726B2Method of forming a bond pad on an I/C chip and resulting structureIBM·Filed 2005·Granted Aug 11, 2009·0 cites·15 claims
- 0445US7767575B2Forming robust solder interconnect structures by reducing effects of seed layer underetchingTESSERA INTELLECTUAL PROPERTIE·Filed 2009·Granted Aug 3, 2010·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →