Inventor · disambiguated record
Junseop Byeon
Also filed as: BYEON JUNSEOP
0 granted patents·3 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0161US2025174585A1Semiconductor die and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0260US2025174571A1Interposer, method of fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0359US2025132234A1Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →