Inventor · disambiguated record
Julian G. Cempa
Also filed as: CEMPA JULIAN G
4 granted patents·139 citations·filing 1992–1993
81Inventor score
Files withIBM4
Top patents by PatentIndex Score
4 records- 0189US5276964AMethod of manufacturing a high density connector systemIBM·Filed 1993·Granted Jan 11, 1994·70 cites·5 claims
- 0259US5401911AVia and pad structure for thermoplastic substrates and method and apparatus for forming the sameIBM·Filed 1992·Granted Mar 28, 1995·30 cites·95 claims
- 0355US5305523AMethod of direct transferring of electrically conductive elements into a substrateIBM·Filed 1992·Granted Apr 26, 1994·25 cites·47 claims
- 0451US5205738AHigh density connector systemIBM·Filed 1992·Granted Apr 27, 1993·14 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →