Inventor · disambiguated record
Jui-Hung Chien
Also filed as: CHIEN JUI-HUNG
16 granted patents·5 pending applications·36 citations·filing 2005–2024
89Inventor score
Files withBIZLINK INT CORPORATION8BIZLINK INT CORP7IND TECH RES INST2KWAI DING-MING1NAT UNIV TSING HUA1
Top patents by PatentIndex Score
21 records- 0197US11228140B2Cable connector and electronic device connection system comprising the sameBIZLINK INT CORPORATION·Filed 2020·Granted Jan 18, 2022·10 cites·10 claims
- 0296US11454774B2Connector with heat sinkBIZLINK INT CORPORATION·Filed 2020·Granted Sep 27, 2022·9 cites·20 claims
- 0395US11075476B2High speed wire end connectorBIZLINK INT CORP·Filed 2020·Granted Jul 27, 2021·5 cites·12 claims
- 0489US10868387B2High speed wire end connector and manufacturing method thereofBIZLINK INT CORP·Filed 2019·Granted Dec 15, 2020·9 cites·11 claims
- 0586US12088037B2Cable end connectorBIZLINK INT CORPORATION·Filed 2022·Granted Sep 10, 2024·1 cites·17 claims
- 0679US11523538B2Connector with high heat dissipation efficiencyBIZLINK INT CORPORATION·Filed 2020·Granted Dec 6, 2022·1 cites·16 claims
- 0770US11631945B2Connector assemblyBIZLINK INT CORP·Filed 2021·Granted Apr 18, 2023·0 cites·15 claims
- 0870US11626690B2Cable end connector with high retaining forceBIZLINK INT CORPORATION·Filed 2021·Granted Apr 11, 2023·0 cites·16 claims
- 0963US11139597B2Connector assemblyBIZLINK INT CORP·Filed 2019·Granted Oct 5, 2021·1 cites·16 claims
- 1061US12200865B2Circuit board with polymer conductive membersBIZLINK INT CORP·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 1158US2024421536A1Wire end connectorBIZLINK INT CORP·Filed 2024·Application pending·0 cites
- 1256US11381027B2Electronic connectorBIZLINK INT CORPORATION·Filed 2020·Granted Jul 5, 2022·0 cites·17 claims
- 1354US2025219326A1ConnectorBIZLINK INT CORP·Filed 2024·Application pending·0 cites
- 1449US11289840B2Cable end connectorBIZLINK INT CORPORATION·Filed 2020·Granted Mar 29, 2022·0 cites·8 claims
- 1549US11165201B2Oblique-insert-proof structure and interface card comprising the sameBIZLINK INT CORPORATION·Filed 2020·Granted Nov 2, 2021·0 cites·5 claims
- 1646US8912448B2Stress relief structureIND TECH RES INST·Filed 2013·Granted Dec 16, 2014·0 cites·17 claims
- 1738US2014160269A1Interposer testing device and method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 1837US9380223B2Device for contactlessly testing passive routing substratesNAT UNIV TSING HUA·Filed 2013·Granted Jun 28, 2016·0 cites·2 claims
- 1934US9048342B2Semiconductor device stacked structureKWAI DING-MING·Filed 2012·Granted Jun 2, 2015·0 cites·21 claims
- 2032US2013214424A1Structure and manufacturing method for reducing stress of chipTSAI NIEN-YU·Filed 2012·Application pending·0 cites
- 2131US2006174693A1Remote humidity monitoring systemTHINKFAR NANOTECHNOLOGY CORP·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →