Inventor · disambiguated record
Jui-Mu Cho
Also filed as: CHO JUI-MU
5 granted patents·6 pending applications·6 citations·filing 2003–2024
69Inventor score
Top patents by PatentIndex Score
11 records- 0179US9123754B2Bonding alignment tool and methodSHIH YUN-TAI·Filed 2011·Granted Sep 1, 2015·6 cites·20 claims
- 0269US11721662B2Wafer bonding method and wafer bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 0362US10847490B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 0458US2025043420A1Atomic layer deposition (ald) with improved particle prevention mechanismTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0553US2025191945A1Smart wafer transport case with sensor systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0653US2025340988A1Semiconductor apparatus for gas mixing and method of film depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0752US2025046633A1Systems and methods for accurate determination of semiconductor wafer temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0851US10396054B2Bonding alignment toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 27, 2019·0 cites·20 claims
- 0940US10345254B2Detection method for electroplating processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·0 cites·20 claims
- 1038US2016222537A1Electroplating apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Application pending·0 cites
- 1136US2005098427A1RF coil design for improved film uniformity of an ion metal plasma sourceTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →