Inventor · disambiguated record
Juil Choi
Also filed as: CHOI JUIL
9 granted patents·15 pending applications·5 citations·filing 2020–2024
79Inventor score
Files withSAMSUNG ELECTRONICS CO LTD24
Top patents by PatentIndex Score
24 records- 0191US12176313B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 24, 2024·2 cites·14 claims
- 0289US11476176B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·2 cites·19 claims
- 0381US11538783B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·1 cites·20 claims
- 0479US12354987B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 0573US11984420B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 0673US11978688B2Semiconductor device having via protective layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 7, 2024·0 cites·20 claims
- 0773US2025079378A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0873US2025014958A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0971US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1063US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 1159US2025149467A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1259US2025062213A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1357US12142541B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·20 claims
- 1457US2025038081A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1557US2025087593A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1655US2024071899A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1753US12400990B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1853US2024079394A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1953US2024213223A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2053US2024088094A1Semiconductor package and system including semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2152US2023042063A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2251US2024096851A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2351US2023361046A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2450US2023038603A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →