Inventor · disambiguated record
Jui-Ping Chuang
Also filed as: CHUANG JUI-PING
25 granted patents·140 citations·filing 1999–2021
95Inventor score
Top patents by PatentIndex Score
25 records- 0198US9553090B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 24, 2017·30 cites·20 claims
- 0297US9899271B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·17 cites·20 claims
- 0397US9559205B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 31, 2017·23 cites·20 claims
- 0492US10326005B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·4 cites·20 claims
- 0586US10686059B2Structure of semiconductor device structure having finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 16, 2020·2 cites·18 claims
- 0685US10101662B2Developing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·3 cites·20 claims
- 0785US10073354B2Exposure method of wafer substrate, manufacturing method of semiconductor device, and exposure toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 11, 2018·3 cites·20 claims
- 0882US11003091B2Method of fabricating reticleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·1 cites·20 claims
- 0982US9733568B2Tool and method of developingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 15, 2017·4 cites·19 claims
- 1077US10534272B2Method of fabricating reticleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·1 cites·20 claims
- 1176US10627718B2Developing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·1 cites·20 claims
- 1275US11940737B2Method of fabricating reticleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 1374US11682716B2Structure of semiconductor device structure having finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·20 claims
- 1471US6553335B2Method and apparatus for determining end-point in a chamber cleaning processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 22, 2003·19 cites·15 claims
- 1570US11150558B2Developing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 1669US10686060B2Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
- 1767US9728533B2Aqueous cleaning techniques and compositions for use in semiconductor device manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 8, 2017·1 cites·20 claims
- 1867US8916429B2Aqueous cleaning techniques and compositions for use in semiconductor device manufacturingCHOU CHUN-LI·Filed 2012·Granted Dec 23, 2014·2 cites·14 claims
- 1965US6524959B1Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and controlTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 25, 2003·11 cites·13 claims
- 2063US10014394B2Structure and formation method of semiconductor device with metal gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 3, 2018·0 cites·20 claims
- 2155US9908201B2Systems and methods for edge bead removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 6, 2018·0 cites·21 claims
- 2255US6716740B2Method for depositing silicon oxide incorporating an outgassing stepTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 6, 2004·6 cites·20 claims
- 2347US6429130B1Method and apparatus for end point detection in a chemical mechanical polishing process using two laser beamsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Aug 6, 2002·12 cites·13 claims
- 2438US9704714B2Method for controlling surface charge on wafer surface in semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 11, 2017·0 cites·21 claims
- 2536US10276469B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →