Inventor · disambiguated record
Justin B. Dorhout
Also filed as: DORHOUT JUSTIN B
74 granted patents·13 pending applications·430 citations·filing 2012–2025
99Inventor score
Top patents by PatentIndex Score
87 records- 0199US9741737B1Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel materialMICRON TECHNOLOGY INC·Filed 2016·Granted Aug 22, 2017·105 cites·8 claims
- 0298US12185546B2Microelectronic devices and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Dec 31, 2024·2 cites·18 claims
- 0398US10580795B1Microelectronic devices including staircase structures, and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 3, 2020·55 cites·25 claims
- 0498US10446578B1Methods used in forming an array of elevationally-extending strings of memory cells, methods of forming an array of elevationally-extending strings of memory cells, and methods of forming an array of vertical strings of memory cellsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 15, 2019·36 cites·27 claims
- 0598US10014309B2Methods of forming an array of elevationally-extending strings of memory cells comprising a programmable charge storage transistor and arrays of elevationally-extending strings of memory cells comprising a programmable charge storage transistorMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 3, 2018·34 cites·26 claims
- 0697US10879267B1Microelectronic devices including staircase structures, and related memory devices and electronic systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 29, 2020·5 cites·20 claims
- 0797US10418379B2Integrated structures comprising channel material extending into source materialMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 17, 2019·12 cites·12 claims
- 0897US10083981B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 25, 2018·22 cites·17 claims
- 0997US9941298B2Methods of forming integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel materialMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 10, 2018·14 cites·8 claims
- 1097US9728548B2Vertical memory blocks and related devices and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 8, 2017·16 cites·25 claims
- 1196US10388665B1Methods of forming an array of elevationally-extending strings of memory cells having a stack comprising vertically-alternating insulative tiers and wordline tiers and horizontally-elongated trenches in the stackMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 20, 2019·46 cites·22 claims
- 1296US10256249B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2017·Granted Apr 9, 2019·10 cites·7 claims
- 1396US10229923B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 12, 2019·10 cites·20 claims
- 1495US11569266B2Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel materialMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 31, 2023·2 cites·7 claims
- 1595US10553607B1Method of forming an array of elevationally-extending strings of programmable memory cells and method of forming an array of elevationally-extending strings of memory cellsMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 4, 2020·13 cites·26 claims
- 1695US10263007B2Methods of forming an array of elevationally-extending strings of memory cells comprising a programmable charge storage transistor and arrays of elevationally-extending strings of memory cells comprising a programmable charge storage transistorMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 16, 2019·11 cites·18 claims
- 1792US11563022B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 24, 2023·6 cites·17 claims
- 1891US12363895B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2024·Granted Jul 15, 2025·0 cites·14 claims
- 1991US10446566B2Integrated assemblies having anchoring structures proximate stacked memory cellsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 15, 2019·8 cites·12 claims
- 2091US2025126791A1Memory devicesLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2190US2025098169A1Integrated StructuresMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2289US12432925B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 2389US11121143B2Integrated assemblies having conductive posts extending through stacks of alternating materialsMICRON TECHNOLOGY INC·Filed 2019·Granted Sep 14, 2021·4 cites·11 claims
- 2489US11094627B2Methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·4 cites·20 claims
- 2589US10734395B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 4, 2020·2 cites·11 claims
- 2689US2025344381A1Microelectronic devices including support pillars, and related memory devicesLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 2788US2024357819A1Integrated Structures Comprising Vertical Channel Material and Having Conductively-Doped Semiconductor Material Directly Against Lower Sidewalls of the Channel Material, and Methods of Forming Integrated StructuresLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 2887US2025275142A1Microelectronic and electronic devices with shouldered pillars or openings extending through a tiered stack, and related methodsLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 2986US12029032B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2023·Granted Jul 2, 2024·0 cites·17 claims
- 3085US12396169B2Microelectronic devices and memory devices including support pillarsLODESTAR LICENSING GROUP LLC·Filed 2024·Granted Aug 19, 2025·0 cites·19 claims
- 3185US12302571B2Microelectronic devices with pillars or openings extending through a tiered stackLODESTAR LICENSING GROUP LLC·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 3283US12010850B2Integrated assemblies which include stacked memory decks, and methods of forming integrated assembliesLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 3382US12029039B2Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel materialLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Jul 2, 2024·0 cites·10 claims
- 3482US11309328B2Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2019·Granted Apr 19, 2022·3 cites·12 claims
- 3581US11706925B2Methods of forming electronic devices with channel openings or pillars extending through a tier stackMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 3680US12213317B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·16 claims
- 3779US11910598B2Microelectronic devices including support pillar structures, and related memory devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 20, 2024·0 cites·15 claims
- 3879US10157933B2Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorusMICRON TECHNOLOGY INC·Filed 2016·Granted Dec 18, 2018·2 cites·29 claims
- 3979US2025142820A1Integrated Assemblies and Methods of Forming Integrated AssembliesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4079US2025142827A1Integrated StructuresMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4178US11696445B2Methods of forming microelectronic devices, and related memory devices, and electronic systemsMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 4278US11631684B2Integrated assemblies and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 18, 2023·0 cites·9 claims
- 4378US10879265B2Microelectronic devices and related methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 29, 2020·1 cites·20 claims
- 4478US2024321727A1Memory arrays comprising operative channel-material strings and dummy pillarsLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 4577US12185537B2Integrated structuresMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 31, 2024·0 cites·31 claims
- 4677US11864387B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 4777US11177271B2Device, a method used in forming a circuit structure, a method used in forming an array of elevationally-extending transistors and a circuit structure adjacent theretoMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 16, 2021·2 cites·8 claims
- 4877US2025391769A1Microelectronic devices including stadium structures, and related methods and electronic systemsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 4975US11937429B2Integrated structures including material containing silicon, nitrogen, and at least one of carbon, oxygen, boron and phosphorusMICRON TECHNOLOGY INC·Filed 2021·Granted Mar 19, 2024·0 cites·18 claims
- 5075US11744072B2Integrated assemblies which include stacked memory decksMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·21 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →