Inventor · disambiguated record
Juil Eom
Also filed as: EOM JUIL
3 granted patents·1 pending application·0 citations·filing 2018–2018
38Inventor score
Files withSK HYNIX INC4
Top patents by PatentIndex Score
4 records- 0141US10665570B2Stack packages including through mold viasSK HYNIX INC·Filed 2018·Granted May 26, 2020·0 cites·19 claims
- 0240US10923434B2Semiconductor packages having EMI shielding layersSK HYNIX INC·Filed 2018·Granted Feb 16, 2021·0 cites·15 claims
- 0338US11342315B2Stack packages including through mold via structuresSK HYNIX INC·Filed 2018·Granted May 24, 2022·0 cites·12 claims
- 0435US2019080999A1Package substrates with signal transmission paths relating to parasitic capacitance valuesSK HYNIX INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →