Inventor · disambiguated record
Junji Fujino
Also filed as: FUJINO JUNJI
46 granted patents·9 pending applications·175 citations·filing 1994–2023
97Inventor score
Top patents by PatentIndex Score
55 records- 0189US10096570B2Manufacturing method for power semiconductor device, and power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 9, 2018·10 cites·19 claims
- 0288US8513892B2Illuminance sensor, and electronic equipment and semiconductor device using the sameUEDAIRA YOSHITSUGU·Filed 2010·Granted Aug 20, 2013·8 cites·22 claims
- 0387US9818716B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 14, 2017·8 cites·6 claims
- 0485US9899345B2Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical powerMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Feb 20, 2018·6 cites·20 claims
- 0580US10978366B2Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power moduleMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 13, 2021·3 cites·19 claims
- 0679US9236316B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jan 12, 2016·5 cites·12 claims
- 0778US10431528B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 1, 2019·3 cites·8 claims
- 0878US5950908ASolder supplying method, solder supplying apparatus and soldering methodMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 14, 1999·58 cites·15 claims
- 0977US11424178B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 23, 2022·1 cites·8 claims
- 1077US9917064B2Semiconductor device with a plate-shaped lead terminalMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Mar 13, 2018·3 cites·16 claims
- 1175US11398447B2Semiconductor device and method for producing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 26, 2022·2 cites·20 claims
- 1273US11004761B2Packaging of a semiconductor device with dual sealing materialsMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 11, 2021·2 cites·7 claims
- 1373US7622750B2Optical device package and optical semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Nov 24, 2009·5 cites·10 claims
- 1472US11538728B2Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrierMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Dec 27, 2022·2 cites·10 claims
- 1572US9443778B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Sep 13, 2016·2 cites·8 claims
- 1671US7838811B2Ambient light sensorROHM CO LTD·Filed 2008·Granted Nov 23, 2010·5 cites·8 claims
- 1770US10559538B2Power moduleMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Feb 11, 2020·2 cites·20 claims
- 1870US8675008B2Calculation device, movement detection device, and electronic instrumentTSUCHIKAWA TAKUYA·Filed 2011·Granted Mar 18, 2014·5 cites·9 claims
- 1970US8003930B2Ambient light sensorROHM CO LTD·Filed 2010·Granted Aug 23, 2011·2 cites·17 claims
- 2069US9455215B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Sep 27, 2016·2 cites·11 claims
- 2169US9142493B2Semiconductor deviceFUJINO JUNJI·Filed 2013·Granted Sep 22, 2015·3 cites·5 claims
- 2267US10727163B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jul 28, 2020·1 cites·13 claims
- 2367US7554480B2Analog/digital converter, illuminance sensor, illumination device, and electronic deviceROHM CO LTD·Filed 2007·Granted Jun 30, 2009·6 cites·12 claims
- 2466US11239123B2Semiconductor module, semiconductor device, and vehicleMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Feb 1, 2022·2 cites·15 claims
- 2566US9433075B2Electric power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Aug 30, 2016·2 cites·19 claims
- 2664US6781108B2Noise canceling photosensor-amplifier deviceROHM CO LTD·Filed 2001·Granted Aug 24, 2004·12 cites·6 claims
- 2763US9029771B2Semiconductor device and electronic apparatus employing the sameUEDAIRA YOSHITSUGU·Filed 2010·Granted May 12, 2015·2 cites·19 claims
- 2861US9698091B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 4, 2017·1 cites·8 claims
- 2959US7875901B2Optical device package and optical semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 2009·Granted Jan 25, 2011·1 cites·4 claims
- 3058US12183647B2Packaging of a semiconductor device with dual sealing materialsMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 31, 2024·0 cites·12 claims
- 3158US9632543B2Mobile deviceROHM CO LTD·Filed 2014·Granted Apr 25, 2017·0 cites·15 claims
- 3257US7626275B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Dec 1, 2009·1 cites·2 claims
- 3355US12087651B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Sep 10, 2024·0 cites·7 claims
- 3455US2025149399A1Power module and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 3553US12062883B2Semiconductor module and method of manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Aug 13, 2024·0 cites·11 claims
- 3652US11557531B2Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jan 17, 2023·0 cites·18 claims
- 3748US12255080B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 18, 2025·0 cites·18 claims
- 3848US2023118890A1Semiconductor device, and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 3947US7679181B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2007·Granted Mar 16, 2010·0 cites·4 claims
- 4047US2012206414A1Mobile deviceTADA YOSHIHIRO·Filed 2010·Application pending·0 cites
- 4146US2008303127A1Cap-less package and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 4245US11631623B2Power semiconductor device and method of manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Apr 18, 2023·0 cites·14 claims
- 4345US7509059B2Optical receiver and data communication apparatus comprising sameROHM CO LTD·Filed 2004·Granted Mar 24, 2009·0 cites·18 claims
- 4444US8159835B2Laser apparatusFUJINO JUNJI·Filed 2009·Granted Apr 17, 2012·0 cites·14 claims
- 4544US5443659AFlux for soldering and solder composition comprising the same and soldering method using the sameMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 22, 1995·10 cites·19 claims
- 4644US2005057169A1Light receiving and emitting electronic apparatusROHM CO LTD·Filed 2004·Application pending·0 cites
- 4743US9691730B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 27, 2017·0 cites·4 claims
- 4841US11183479B2Semiconductor device, method for manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Nov 23, 2021·0 cites·16 claims
- 4941US2007166050A1Optical communication moduleROHM CO LTD·Filed 2005·Application pending·0 cites
- 5041US2009312987A1Ambient Light Sensor and Electronic EquipmentROHM CO LTD·Filed 2007·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →