Inventor · disambiguated record
Junzo Fukuta
Also filed as: FUKUTA JUNZO
13 granted patents·264 citations·filing 1993–2005
93Inventor score
Files withSUMITOMO METAL CERAMICS INC4MURATA MANUFACTURING CO3SUMITOMO METAL SMI ELECTRONICS3SUMITOMO METAL ELECTRONICS DEV2SUMOTOMO METAL ELECTRONICS DEV1
Top patents by PatentIndex Score
13 records- 0174US7618843B2Method of fabricating multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2005·Granted Nov 17, 2009·6 cites·16 claims
- 0273US5456778AMethod of fabricating ceramic circuit substrateSUMITOMO METAL CERAMICS INC·Filed 1993·Granted Oct 10, 1995·51 cites·10 claims
- 0366US5814366AMethod of manufacturing multilayered ceramic substrateSUMITOMO METAL ELECTRONICS DEV·Filed 1996·Granted Sep 29, 1998·40 cites·11 claims
- 0464US6852569B2Method of fabricating multilayer ceramic substrateMURATA MANUFACTURING CO·Filed 2002·Granted Feb 8, 2005·12 cites·11 claims
- 0562US5470412AProcess for producing a circuit substrateSUMITOMO METAL CERAMICS INC·Filed 1993·Granted Nov 28, 1995·31 cites·24 claims
- 0657US7004984B2Method of producing ceramic multilayer substrateMURATA MANUFACTURING CO·Filed 2004·Granted Feb 28, 2006·7 cites·20 claims
- 0757US5597644ACeramic circuit board and process for producing sameSUMITOMO METAL CERAMICS INC·Filed 1995·Granted Jan 28, 1997·23 cites·18 claims
- 0856US6042667AMethod of fabricating ceramic multilayer substrateSUMOTOMO METAL ELECTRONICS DEV·Filed 1997·Granted Mar 28, 2000·20 cites·13 claims
- 0956US5847326ALow-temperature fired ceramic circuit substrate with improved Ag-Au connection reliabilitySUMITOMO METAL ELECTRONICS DEV·Filed 1997·Granted Dec 8, 1998·26 cites·9 claims
- 1055US5879788ALow-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereofSUMITOMO METAL SMI ELECTRONICS·Filed 1997·Granted Mar 9, 1999·18 cites·7 claims
- 1151US5665459ALow-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereofSUMITOMO METAL CERAMICS INC·Filed 1996·Granted Sep 9, 1997·15 cites·4 claims
- 1243US5766516ASilver-based conductive paste and multilayer ceramic circuit substrate using the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1996·Granted Jun 16, 1998·11 cites·4 claims
- 1333US5723073AConductive paste containing 2-tetradecanol and ceramic circuit substrate using the sameSUMITOMO METAL SMI ELECTRONICS·Filed 1996·Granted Mar 3, 1998·4 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →