Inventor · disambiguated record
Justin C. Hackley
Also filed as: HACKLEY JUSTIN · HACKLEY JUSTIN C
7 granted patents·9 citations·filing 2018–2023
76Inventor score
Files withGRANINGER AURELIUS L2ENGBRECHT EDWARD R1HACKLEY JUSTIN C1HARTMAN JEFFREY DAVID1HATHAWAY AARON ASHLEY1
Top patents by PatentIndex Score
7 records- 0179US11616187B2Superconducting bump bond electrical characterizationGRANINGER AURELIUS L·Filed 2021·Granted Mar 28, 2023·1 cites·20 claims
- 0279US10950778B2Superconducting bump bond electrical characterizationGRANINGER AURELIUS L·Filed 2019·Granted Mar 16, 2021·3 cites·11 claims
- 0379US10644218B1Multichip device with temperature isolating bump bondsHATHAWAY AARON ASHLEY·Filed 2019·Granted May 5, 2020·3 cites·20 claims
- 0469US10651233B2Method for forming superconducting structuresHARTMAN JEFFREY DAVID·Filed 2018·Granted May 12, 2020·2 cites·12 claims
- 0560US12494599B2Silicon flexible connectorsENGBRECHT EDWARD R·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 0659US12375083B2Superconducting phase-change material switchNORTHROP GRUMMAN SYSTEMS CORP·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 0748US12354988B2Bump structures for low temperature chip bondingHACKLEY JUSTIN C·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →