Inventor · disambiguated record
Jung Kyu Han
Also filed as: HAN JUNG KYU
19 granted patents·34 pending applications·18 citations·filing 2014–2024
89Inventor score
Files withINTEL CORP41HYUNDAI MOTOR CO LTD6SEOUL NAT UNIV R&DB FOUNDATION2HYUNDAI MOBIS CO LTD1KOREA ADVANCED INST SCI & TECH1
Top patents by PatentIndex Score
53 records- 0194US10431537B1Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2018·Granted Oct 1, 2019·11 cites·26 claims
- 0290US11309239B2Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2020·Granted Apr 19, 2022·2 cites·20 claims
- 0389US11935857B2Surface finishes with low RBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2022·Granted Mar 19, 2024·1 cites·22 claims
- 0481US11488918B2Surface finishes with low rBTV for fine and mixed bump pitch architecturesINTEL CORP·Filed 2018·Granted Nov 1, 2022·3 cites·15 claims
- 0576US11699648B2Electromigration resistant and profile consistent contact arraysTAHOE RES LTD·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 0670US2024243088A1Copperless regions to control plating growthINTEL CORP·Filed 2024·Application pending·0 cites
- 0763US11025161B2Electric vehicle and charging apparatus thereofHYUNDAI MOTOR CO LTD·Filed 2018·Granted Jun 1, 2021·1 cites·11 claims
- 0862US10854541B2Electromigration resistant and profile consistent contact arraysINTEL CORP·Filed 2019·Granted Dec 1, 2020·0 cites·24 claims
- 0962US2023212391A1Thermoplastic resin composition for low gloss non-painting, method for manufacturing molded article using same, and molded articleHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 1061US2023112893A1Thermoplastic resin composition for high-brightness unpainted metallic material and a molded article including the sameHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 1159US12476214B2Solder interconnect hierarchy for heterogeneous electronic device packagingINTEL CORP·Filed 2021·Granted Nov 18, 2025·0 cites·20 claims
- 1258US12341117B2Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·25 claims
- 1358US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1457US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 1557US2022372243A1Antimicrobial composition having excellent antimicrobial property and improved chemical resistance, and molded article including sameHYUNDAI MOTOR CO LTD·Filed 2021·Application pending·0 cites
- 1656US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 1756US2024387396A1Surface finishes for contacts and fiducial markers on integrated circuit package substrates and associated methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1856US2025201720A1Methods, systems, apparatus, and articles of manufacture to reduce intermetallic compound formation in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1956US2025006671A1Semiconductor layer with dry deposition layerINTEL CORP·Filed 2023·Application pending·0 cites
- 2055US12237759B2High-efficiency integrated power circuit with reduced number of semiconductor elements and multiple output portsKOREA AEROSPACE RES INST·Filed 2022·Granted Feb 25, 2025·0 cites·11 claims
- 2155US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2255US2024332134A1Methods and apparatus to mitigate electromigration in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2355US2025374426A1Automated manufacturing of hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 2455US2025144857A1Molding system and molding methodINTEL CORP·Filed 2023·Application pending·0 cites
- 2555US2024312924A1Fiducial design optimization for land side device anywhere package assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 2654US12060485B2Low gloss non-coating thermoplastic resin composition, method for manufacturing molded article by using the same, and molded article manufactured through the sameHYUNDAI MOTOR CO LTD·Filed 2020·Granted Aug 13, 2024·0 cites·14 claims
- 2754US2024213198A1Under bump metallizations, solder compositions, and structures for die interconnects on integrated circuit packagingINTEL CORP·Filed 2022·Application pending·0 cites
- 2854US2025218984A1Encapsulation techniques for components embedded in a core layer of a package substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2954US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 3053US12334422B2Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·24 claims
- 3153US2025006645A1Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulationINTEL CORP·Filed 2023·Application pending·0 cites
- 3253US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 3353US2024213163A1Interconnect device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 3452US11955448B2Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitchesINTEL CORP·Filed 2020·Granted Apr 9, 2024·0 cites·25 claims
- 3552US2025218953A1Methods and apparatus for embedding interconnect bridges having through silicon vias in substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3652US2025218885A1Patterned mold underfill (muf) films for deep trench fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 3752US2021347986A1Uncoating metallic thermoplastic resin composition and molded article thereofHYUNDAI MOTOR CO LTD·Filed 2020·Application pending·0 cites
- 3852US2023420358A1Integrated circuit packages with silver and silicon nitride multi-layerINTEL CORP·Filed 2022·Application pending·0 cites
- 3951US11108332B2Half-bridge converter including rectifier structure using coupling inductorKOREA ADVANCED INST SCI & TECH·Filed 2020·Granted Aug 31, 2021·0 cites·15 claims
- 4051US2021082852A1Copperless regions to control plating growthINTEL CORP·Filed 2019·Application pending·0 cites
- 4151US2024114622A1Embedded passives with cavity sidewall interconnect in glass core architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 4250US2024186279A1In-situ uv cure placement tool for room temperature chip/glass device attachmentINTEL CORP·Filed 2022·Application pending·0 cites
- 4349US2023088928A1Embedded glass cores in package substrates and related methodsINTEL CORP·Filed 2021·Application pending·0 cites
- 4448US2023091379A1First level interconnect under bump metallizations for fine pitch heterogeneous applicationsINTEL CORP·Filed 2021·Application pending·0 cites
- 4548US2024222216A1Patterned sheet muf for complex packages and methods of producingINTEL CORP·Filed 2022·Application pending·0 cites
- 4647US2023086920A1Dam surrounding a die on a substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 4747US2024210634A1Functionally graded index mold for co-packaged optical applicationsINTEL CORP·Filed 2022·Application pending·0 cites
- 4846US10982091B2Thermoplastic resin composition having excellent thermal stability and low birefringence and molded atricle thereofHYUNDAI MOBIS CO LTD·Filed 2018·Granted Apr 20, 2021·0 cites·9 claims
- 4946US2024188223A1Material deposition apparatus and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 5046US2024178151A1Overlying fiducial design for glass placement accuracy improvementINTEL CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Jung Kyu Han files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →