Inventor · disambiguated record
Jun He
Also filed as: HE JUN · HE JUN ZHI
14 granted patents·29 pending applications·24 citations·filing 2017–2025
86Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22PURE STORAGE INC5SHANGHAI BILIBILI TECH CO LTD3UNIV NINGXIA2UNIV SHENZHEN2
Top patents by PatentIndex Score
43 records- 0195US11886922B2Scheduling input/output operations for a storage systemPURE STORAGE INC·Filed 2022·Granted Jan 30, 2024·6 cites·20 claims
- 0292US10992512B2File sharing method, apparatus, and storage mediumTENCENT TECH SHENZHEN CO LTD·Filed 2019·Granted Apr 27, 2021·15 cites·20 claims
- 0381US12410039B2Multi-tower linkage type aerial hoisting platformWUHAN CONSTRUCTION ENG GROUP CO LTD·Filed 2023·Granted Sep 9, 2025·1 cites·7 claims
- 0481US11450146B2Gesture recognition method, apparatus, and deviceHUAWEI TECH CO LTD·Filed 2020·Granted Sep 20, 2022·2 cites·20 claims
- 0577US2025357268A1Semiconductor Device Package with Thermal ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0676US2025357269A1Multizone thermal device for semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0775US12242896B2Queueing storage operationsPURE STORAGE INC·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 0875US2025343084A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0975US2025351303A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1074US2025357270A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1173US2025349657A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1272US2025336768A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1372US2025343103A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1472US2025336769A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1571US2025210420A1Integrated circuit packages and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1671US2025246516A1Multizone thermal device for semiconductor structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1770US2025227884A1Heat sink structure and methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1868US2025201668A1Structure and formation method of package with heat-spreading lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1968US2025201652A1Chip package structure with lid and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2068US2025210458A1Thermal structure for semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2167US2025218895A1Integrated Circuit Package Structure with Thermelectric Self-Cooling DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2267US2025201658A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2360US2025165264A1Method, apparatus, device and storage medium for information interactionBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2024·Application pending·0 cites
- 2459US12045252B2Providing quality of service (QoS) for replicating datasetsPURE STORAGE INC·Filed 2022·Granted Jul 23, 2024·0 cites·15 claims
- 2557US12008266B2Efficient read by reconstructionPURE STORAGE INC·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 2656US10786937B2Processing technology for making seepage irrigation pipe with alternate effluent section and non-effluent sectionUNIV NINGXIA·Filed 2018·Granted Sep 29, 2020·0 cites·3 claims
- 2756US2025221310A1Adaptive liquid cooling system for chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2856US2025372475A1Heat-Dissipating Lid ModuleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2956US2025351293A1Dynamic liquid cooling for integrated deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3055US11541586B2Processing technology for making seepage irrigation pipe with alternate effluent section and non-effluent sectionUNIV NINGXIA·Filed 2020·Granted Jan 3, 2023·0 cites·4 claims
- 3155US2025309071A1Spacer frame for graphite thermal interface materialsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3255US2020103586A1Device for fabricating optical fiber bragg grating and the method thereofUNIV SHENZHEN·Filed 2019·Application pending·0 cites
- 3354US12299033B2Video generating method and deviceSHANGHAI BILIBILI TECH CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 3454US2025218986A1Method for forming device substrate, method for forming package structure and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3554US2024352688A1Stiffening girder erection method of ground-anchored suspension bridgeUNIV GUANGXI·Filed 2024·Application pending·0 cites
- 3653US2025301347A1Method and monitoring system for monitoring a signal with inherent periodic characteristicsROHDE & SCHWARZ·Filed 2025·Application pending·0 cites
- 3752US2025156236A1Queueing Storage OperationsPURE STORAGE INC·Filed 2025·Application pending·0 cites
- 3851US2024394507A1Method, apparatus, system, medium and electronic device for generating graph neural networkLEMON INC·Filed 2022·Application pending·0 cites
- 3950US12113993B2Video processing method and deviceSHANGHAI BILIBILI TECH CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·17 claims
- 4043US11092747B2Whispering gallery mode resonator and manufacturing method thereofUNIV SHENZHEN·Filed 2017·Granted Aug 17, 2021·0 cites·10 claims
- 4143US2025184305A1Video stream acquisition method, apparatus and system, and device and mediumBEIJING BYTEDANCE NETWORK TECH CO LTD·Filed 2023·Application pending·0 cites
- 4240US11829687B2Method for inversion of corresponding line mileage and offset by using known coordinate pointCHINA RAILWAY NO 2 ENG GROUP CO LTD·Filed 2023·Granted Nov 28, 2023·0 cites·11 claims
- 4338US12210558B2Multimedia file storage and access methodSHANGHAI BILIBILI TECH CO LTD·Filed 2020·Granted Jan 28, 2025·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Jun He files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →