Inventor · disambiguated record
Jun He
Also filed as: HE JUN · HE JUN-JIE
77 granted patents·40 pending applications·285 citations·filing 1995–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD47INTEL CORP21ANHUI ANUKI TECH CO LTD18HE JUN8ANHUI YUNTA ELECTRONIC TECH CO LTD4
Top patents by PatentIndex Score
117 records- 0188US2025364441A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0288US2025372540A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0387US12313675B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 0487US12270852B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 8, 2025·0 cites·20 claims
- 0586US7087452B2Edge arrangements for integrated circuit chipsINTEL CORP·Filed 2003·Granted Aug 8, 2006·59 cites·17 claims
- 0684US8058710B2Interconnects having sealing structures to enable selective metal capping layersHE JUN·Filed 2008·Granted Nov 15, 2011·6 cites·9 claims
- 0784US7402519B2Interconnects having sealing structures to enable selective metal capping layersINTEL CORP·Filed 2005·Granted Jul 22, 2008·6 cites·6 claims
- 0884US6998216B2Mechanically robust interconnect for low-k dielectric material using post treatmentINTEL CORP·Filed 2002·Granted Feb 14, 2006·33 cites·24 claims
- 0983US12094631B2Chip inductor and method for manufacturing sameANHUI ANUKI TECH CO LTD·Filed 2019·Granted Sep 17, 2024·2 cites·9 claims
- 1083US12066484B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 1183US11073551B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·1 cites·20 claims
- 1283US7662674B2Methods of forming electromigration and thermal gradient based fuse structuresINTEL CORP·Filed 2005·Granted Feb 16, 2010·10 cites·9 claims
- 1383US6919637B2Interconnect structure for an integrated circuit and method of fabricationINTEL CORP·Filed 2002·Granted Jul 19, 2005·30 cites·9 claims
- 1482US12349268B2Package componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 1582US12025655B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·20 claims
- 1681US6838299B2Forming defect prevention trenches in dicing streetsINTEL CORP·Filed 2001·Granted Jan 4, 2005·27 cites·20 claims
- 1780US2025357458A1Semiconductor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1880US2025364384A1Reduction of cracks in redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1980US2025364391A1Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2079US12334465B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 2179US7151051B2Interconnect structure for an integrated circuit and method of fabricationINTEL CORP·Filed 2005·Granted Dec 19, 2006·7 cites·11 claims
- 2278US12237226B2Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 2378US11754621B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·19 claims
- 2478US7402509B2Method of forming self-passivating interconnects and resulting devicesINTEL CORP·Filed 2005·Granted Jul 22, 2008·5 cites·32 claims
- 2578US2025359150A1Semiconductor structures for monitoring plasma process-induced damagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2678US2025364418A1Graphene-clad metal interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2778US2025072028A1Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2877US8704336B2Selective removal of on-die redistribution interconnects from scribe-linesHE JUN·Filed 2007·Granted Apr 22, 2014·6 cites·7 claims
- 2977US2025286007A1Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3077US2025357217A1Edge profile control of integrated circuit chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3177US2024379825A1Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3276US11929725B2Bandpass filter circuit and multiplexerANHUI ANUKI TECH CO LTD·Filed 2020·Granted Mar 12, 2024·1 cites·4 claims
- 3375US12482763B2Semiconductor device package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 3475US11924965B2Package component and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 3575US2024395621A1Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3674US11630149B2Method and system for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 18, 2023·0 cites·20 claims
- 3774US11448692B2Method and device for wafer-level testingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·18 claims
- 3874US2025309104A1Delamination control of dielectric layers of integrated circuit chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3973US11081392B2Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
- 4072US9437545B2Interconnects having sealing structures to enable selective metal capping layersINTEL CORP·Filed 2014·Granted Sep 6, 2016·1 cites·6 claims
- 4172US2025266380A1Heat dissipating features for laser drilling processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4272US2025133770A1Semiconductor structures for monitoring plasma process-induced damagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4371US12170327B2Semiconductor structure and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 4471US7889013B2Microelectronic die having CMOS ring oscillator thereon and method of using sameINTEL CORP·Filed 2007·Granted Feb 15, 2011·4 cites·11 claims
- 4571US2024047830A1Electrochemical apparatus and electronic apparatus including the electrochemical apparatusNINGDE AMPEREX TECHNOLOGY LTD·Filed 2023·Application pending·0 cites
- 4670US12476178B2Reduction of cracks in redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 4770US12322716B2Heat dissipating features for laser drilling processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 4870US11984422B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
- 4970US7544966B2Three-terminal electrical bistable devicesUNIV CALIFORNIA·Filed 2004·Granted Jun 9, 2009·15 cites·23 claims
- 5070US7071554B2Stress mitigation layer to reduce under bump stress concentrationINTEL CORP·Filed 2004·Granted Jul 4, 2006·16 cites·14 claims
Showing the top 50 of 117 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →