Inventor · disambiguated record
Jun Yeong Heo
Also filed as: HEO JUN YEONG
3 granted patents·2 pending applications·2 citations·filing 2019–2024
51Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0177US11069541B2Semiconductor device package for debonding substrate assembly from carrier substrate using light and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 0273US2024379626A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0366US12074141B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·13 claims
- 0456US2025046659A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0540US10804212B2Semiconductor device and package including modified region of less density at edge of device or substrateSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →