Inventor · disambiguated record
Junyeong Heo
Also filed as: HEO JUNYEONG
13 granted patents·7 pending applications·19 citations·filing 2015–2025
86Inventor score
Top patents by PatentIndex Score
20 records- 0196US11424172B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 23, 2022·6 cites·12 claims
- 0295US11869821B2Semiconductor package having molding layer with inclined side wallSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·4 cites·20 claims
- 0381US9875992B2Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the sameHEO JUNYEONG·Filed 2015·Granted Jan 23, 2018·6 cites·15 claims
- 0480US11469180B2Semiconductor device including an insulating material layer with concave-convex portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·19 claims
- 0580US11239171B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 1, 2022·1 cites·20 claims
- 0679US2025357216A1Semiconductor substrate and method of dicing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0778US11721669B2Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widthsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·17 claims
- 0877US11996367B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 0977US2024379478A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1075US12094794B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 1173US2025300137A1Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1271US11694963B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 4, 2023·0 cites·20 claims
- 1369US11515226B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1467US11935832B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 1564US12355004B2Semiconductor chip and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 1658US2025167031A1Carrier substrate and manufacturing method of semiconductor package using sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1757US12406888B2Semiconductor substrate and method of dicing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·16 claims
- 1856US2024312823A1Method of splitting semiconductor chip using mechanical machining and semiconductor chip split by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1953US2025015025A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2052US2024203946A1Semiconductor chip, semiconductor package, and wafer dicing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →