Inventor · disambiguated record
Junya Horiuchi
Also filed as: HORIUCHI JUNYA
4 granted patents·17 pending applications·3 citations·filing 2016–2022
59Inventor score
Files withMITSUBISHI GAS CHEMICAL CO21
Top patents by PatentIndex Score
21 records- 0176US10577323B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Mar 3, 2020·1 cites·12 claims
- 0272US10364314B2Compound, resin, material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography, resist pattern forming method, circuit pattern forming method, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 30, 2019·2 cites·21 claims
- 0357US2024319600A1Film forming material for lithography, composition, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0455US2022089810A1Polycyclic polyphenolic resin and method for producing polycyclic polyphenolic resinMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 0553US2022019146A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 0653US2023314942A1Polycyclic polyphenolic resin, composition, method for producing polycyclic polyphenolic resin, composition for film formation, resist composition, resist pattern formation method, radiation-sensitive composition, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 0752US2022010072A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 0850US2024109997A1Resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0949US2024117102A1Polymer, composition, method for producing polymer, composition for film formation, resist composition, resist pattern formation method, radiation-sensitive composition, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1048US11747728B2Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Sep 5, 2023·0 cites·18 claims
- 1148US2023296982A1Polymer, composition, method for producing polymer, composition, composition for film formation, resist composition, radiation-sensitive composition, composition for underlayer film formation for lithography, resist pattern formation method, method for producing underlayer film for lithography, circuit pattern formation method, and composition for optical member formationMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1246US2024117101A1Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, circuit pattern formation method, composition for optical member formation, resin for underlayer film formation, resist resin, radiation-sensitive resin, and resin for underlayer film formation for lithographyMITSUBISHI GAS CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1345US2020002307A1Method for purifying compound or resin and method for producing compositionMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 1443US2022089811A1Composition for film formation, resist composition, radiation-sensitive composition, method for producing amorphous film, resist pattern formation method, composition for underlayer film formation for lithography, method for producing underlayer film for lithography, and circuit pattern formation methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1542US2021405529A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1642US2022155682A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, method for forming pattern, and purification methodMITSUBISHI GAS CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1742US2021165327A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1841US2021278767A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
- 1940US12134596B2Compound, resin, composition, resist pattern formation method, circuit pattern formation method and method for purifying resinMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Nov 5, 2024·0 cites·20 claims
- 2038US2020166844A1Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming patternMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 2133US2018044270A1Compound, resin, material for forming underlayer film for lithography, underlayer film for lithography, pattern forming method, and method for purifying compound or resinMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
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