Inventor · disambiguated record
Junwei Hu
Also filed as: HU JUNWEI
2 granted patents·1 pending application·6 citations·filing 2010–2023
49Inventor score
Top patents by PatentIndex Score
3 records- 0176US11984915B2Temperature compensation circuit and phased array apparatusHUAWEI TECH CO LTD·Filed 2021·Granted May 14, 2024·1 cites·19 claims
- 0265US9105647B2Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill materialHU JUNWEI·Filed 2010·Granted Aug 11, 2015·5 cites·14 claims
- 0344US2023366304A1Apparatus and technique for simulating the propagation of shale fractures under high temperature convective heatUNIV CHINA PETROLEUM EAST CHINA·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Junwei Hu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →