Inventor · disambiguated record
Junfu Hu
Also filed as: HU JUNFU
2 granted patents·1 pending application·2 citations·filing 2015–2022
39Inventor score
Top patents by PatentIndex Score
3 records- 0179US11251116B2Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the sameHUAWEI TECH CO LTD·Filed 2020·Granted Feb 15, 2022·2 cites·12 claims
- 0259US11823996B2Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the sameHUAWEI TECH CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·13 claims
- 0324US2016230374A1Rinse Down Sink and Disposal SystemJUST MFG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →