Inventor · disambiguated record
Jung-Chi Jeng
Also filed as: JENG JUNG-CHI
29 granted patents·14 pending applications·35 citations·filing 2012–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD40JENG JUNG-CHI1TAIWAN SEMICONDUCTOR MANUFACTUING CO LTD1TSAI TSUNG-HAN1
Top patents by PatentIndex Score
43 records- 0192US11699702B2Input/output devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 11, 2023·3 cites·20 claims
- 0289US12119265B2High voltage devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 15, 2024·2 cites·20 claims
- 0389US9812569B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 7, 2017·6 cites·4 claims
- 0488US10090392B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 2, 2018·9 cites·19 claims
- 0586US9728637B2Mechanism for forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·4 cites·20 claims
- 0684US2025351565A1Semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0782US12224213B2High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 11, 2025·1 cites·20 claims
- 0882US9281215B2Mechanism for forming gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·5 cites·13 claims
- 0981US2024395947A1Finfet mos capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1080US10680103B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·2 cites·20 claims
- 1178US12389625B2Semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1278US2025142953A1Semiconductor devicesTAIWAN SEMICONDUCTOR MANUFACTUING CO LTD·Filed 2024·Application pending·0 cites
- 1378US2025344488A1High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1477US12342553B2Semiconductor devices and methods for increased capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 1577US2025287617A1Semiconductor devices and methods for increased capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1675US12199193B2FinFET MOS capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 1774US2024387284A1High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1873US2024387531A1Input/output devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1973US2024387520A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2072US11855175B2Fabrication of long gate devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2171US12336199B2Semiconductor devices and methods for increased capacitanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2271US11469335B2FinFET MOS capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·20 claims
- 2370US10510671B2Method for forming semiconductor device structure with conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 2469US12176347B2Input/output devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 2569US11600727B2Method of forming semiconductor device with gateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 2669US9865731B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 9, 2018·2 cites·20 claims
- 2768US10879186B1Method for forming semiconductor device structure with conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 29, 2020·0 cites·20 claims
- 2867US12218134B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 2966US2022376045A1High voltage deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3065US12094874B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 3162US10770401B2Method for forming semiconductor device structure with conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·20 claims
- 3261US11444175B2Fabrication of long gate devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 3360US12477841B2Semiconductor image-sensing structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 3456US12476126B2Wafer holder assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 3556US10516048B2Fabrication of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 3656US2024429260A1Methods for forming a back side film stack and package structures thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3756US2025176203A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3855US2025142940A1Semiconductor device including gate dielectrics of different thicknesses and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3954US2025185354A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4051US2025022958A1Semiconductor device and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4148US8951826B2Method for increasing photodiode full well capacityJENG JUNG-CHI·Filed 2012·Granted Feb 10, 2015·0 cites·20 claims
- 4245US9711468B2Bonding pad structure with dense via arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 18, 2017·0 cites·20 claims
- 4345US9041204B2Bonding pad structure with dense via arrayTSAI TSUNG-HAN·Filed 2012·Granted May 26, 2015·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Jung-Chi Jeng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →