Inventor · disambiguated record
Jungho Jin
Also filed as: JIN JUNGHO
3 granted patents·3 pending applications·14 citations·filing 2009–2024
65Inventor score
Files withBAE BYEONG-SOO1KOREA ADVANCED INST SCI & TECH1SAMSUNG ELECTRONICS CO LTD1UNIV WASHINGTON1UNIV WASHINGTON CT COMMERCIALI1
Top patents by PatentIndex Score
6 records- 0171US8372504B2Transparent composite compoundKOREA ADVANCED INST SCI & TECH·Filed 2009·Granted Feb 12, 2013·6 cites·7 claims
- 0270US8801997B2Fabrication method of flexible devicesBAE BYEONG-SOO·Filed 2011·Granted Aug 12, 2014·3 cites·9 claims
- 0364US10751050B2Microstructure-based wound closure devicesUNIV WASHINGTON THROUGH ITS CENTER FOR COMMERCIALIZATION·Filed 2013·Granted Aug 25, 2020·5 cites·20 claims
- 0458US2025159808A1Printed circuit board, memory module including the same, and method of manufacturing printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0548US2020345366A1Microstructure-based wound closure devicesUNIV WASHINGTON·Filed 2020·Application pending·0 cites
- 0639US2014194379A1Methods for the production of chitin nanofibers and uses thereofUNIV WASHINGTON CT COMMERCIALI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →