Inventor · disambiguated record
Junhyeung Jo
Also filed as: JO JUNHYEUNG
1 granted patent·4 pending applications·0 citations·filing 2022–2024
13Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0162US12463126B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0257US2025191986A1Semiconductor packages including molding guide patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0353US2025210382A1Jig for dispensing an underfilling materialSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0452US2024128190A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0552US2025201641A1Semiconductor packages having a substrate with connecting portionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →