Inventor · disambiguated record
Jung Hyuk Jung
Also filed as: JUNG JUNG HYUK
24 granted patents·1 pending application·54 citations·filing 2014–2023
93Inventor score
Files withSAMSUNG ELECTRO MECH25
Top patents by PatentIndex Score
25 records- 0197US9945042B2Chip electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Apr 17, 2018·18 cites·12 claims
- 0295US10388447B2Multilayer seed pattern inductor, manufacturing method thereof, and board having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 20, 2019·8 cites·24 claims
- 0394US10614943B2Multilayer seed pattern inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Apr 7, 2020·7 cites·22 claims
- 0494US10515752B2Thin film inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 24, 2019·6 cites·7 claims
- 0589US10431368B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 1, 2019·3 cites·19 claims
- 0687US10861630B2InductorSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 8, 2020·4 cites·19 claims
- 0787US10801121B2Chip electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 13, 2020·1 cites·10 claims
- 0885US10902988B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 26, 2021·2 cites·17 claims
- 0985US10319515B2Chip electronic componentSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 11, 2019·3 cites·14 claims
- 1077US11107621B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 31, 2021·1 cites·13 claims
- 1175US11056274B2Thin film type inductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 6, 2021·1 cites·19 claims
- 1273US12308150B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted May 20, 2025·0 cites·15 claims
- 1371US11069469B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Jul 20, 2021·0 cites·9 claims
- 1468US11605484B2Multilayer seed pattern inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 14, 2023·0 cites·19 claims
- 1565US11276520B2Multilayer seed pattern inductor, manufacturing method thereof, and board having the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 15, 2022·0 cites·20 claims
- 1663US12340932B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 24, 2025·0 cites·17 claims
- 1762US2023395298A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1861US11488767B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 1959US11610724B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 21, 2023·0 cites·10 claims
- 2059US11495393B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 2158US12437911B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
- 2258US11615911B2Coil component having dual insulating structureSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 28, 2023·0 cites·19 claims
- 2358US10629362B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 21, 2020·0 cites·19 claims
- 2457US11721474B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 8, 2023·0 cites·20 claims
- 2555US12148561B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 19, 2024·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →