Inventor · disambiguated record
Ju-Hwan Jung
Also filed as: JUNG JU HWAN
52 granted patents·12 pending applications·146 citations·filing 2003–2024
97Inventor score
Top patents by PatentIndex Score
64 records- 0188US9800814B2Image sensor, method of operating the same, and image processing system including the sameJIN YOUNG GU·Filed 2015·Granted Oct 24, 2017·5 cites·18 claims
- 0288US7319224B2Semiconductor probe with resistive tip and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 15, 2008·14 cites·10 claims
- 0388US7316072B2XY stage module, storage system employing the same and method for fabricating the XY stage moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 8, 2008·8 cites·19 claims
- 0485US9106858B2Image sensor, method of operating the same, and image processing system including the sameJIN YOUNG GU·Filed 2013·Granted Aug 11, 2015·5 cites·27 claims
- 0584US9406714B2Unit pixel with photodiode under gate of sensing transistor and image pixel array including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 2, 2016·3 cites·19 claims
- 0681US9462199B2Image sensors, image processing systems including same, and methods of operating the sameKIM SUN JUNG·Filed 2013·Granted Oct 4, 2016·6 cites·25 claims
- 0780US9894301B2CMOS image sensors with photogate structures and sensing transistors, operation methods thereof, and image processing systems including the sameJIN YOUNG GU·Filed 2015·Granted Feb 13, 2018·2 cites·28 claims
- 0880US9366635B2Optical biosensor and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 14, 2016·3 cites·18 claims
- 0979US7406020B2Method of writing data on a storage device using a probe techniqueSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 29, 2008·13 cites·15 claims
- 1076US7479212B2Method of manufacturing high-density data storage mediumSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jan 20, 2009·2 cites·4 claims
- 1176US7141999B2Semiconductor probe with resistive tip and method of fabricating the same, and information recording apparatus, information reproducing apparatus, and information measuring apparatus having the semiconductor probeSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 28, 2006·15 cites·8 claims
- 1275US7170843B2High-density data storage medium, method of manufacturing the data storage medium, data storage apparatus, and methods of writing data on, and reading and erasing data from the data storage medium by using the data storage apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 30, 2007·8 cites·42 claims
- 1374US7911928B2High density data storage device and data recording or reproduction method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 22, 2011·2 cites·2 claims
- 1473US7808025B2Electric field read/write head, method of manufacturing the same, and information storage device comprising the electric field read/write headSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 5, 2010·2 cites·15 claims
- 1573US7411210B2Semiconductor probe with resistive tip having metal shield thereonSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 12, 2008·5 cites·17 claims
- 1669US9118856B2Sensor, data processing system, and operating methodKIM WON JOO·Filed 2012·Granted Aug 25, 2015·2 cites·17 claims
- 1768US7442571B2Semiconductor probe with resistive tip and method of fabricating the same, and information recording apparatus, information reproducing apparatus, and information measuring apparatus having the semiconductor probeSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 28, 2008·2 cites·2 claims
- 1867US7759954B2Semiconductor probe having resistive tip and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·7 claims
- 1967US7338831B2Method of fabricating semiconductor probe with resistive tipSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 4, 2008·11 cites·7 claims
- 2066US7671616B2Semiconductor probe having embossed resistive tip and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 2, 2010·2 cites·8 claims
- 2166US7464584B2Semiconductor probe and method of writing and reading information using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 16, 2008·2 cites·4 claims
- 2262US12369411B2Indirect Time-of-Flight (ToF) pixel structureDB HITEK CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·14 claims
- 2362US7889628B2Ferroelectric recording medium and writing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 15, 2011·0 cites·10 claims
- 2462US7142077B2Two-axis actuator with large stageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 28, 2006·11 cites·21 claims
- 2562US7008811B2Method of fabricating probe for SPM having FET channel structure utilizing self-aligned fabricationSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 7, 2006·9 cites·6 claims
- 2662US2025169205A1Method of manufacturing micro-lens of image sensorDB HITEK CO LTD·Filed 2024·Application pending·0 cites
- 2761US11664473B2SPAD pixel structure and method of manufacturing sameDB HITEK CO LTD·Filed 2022·Granted May 30, 2023·0 cites·18 claims
- 2861US7659562B2Electric field read/write head and method of manufacturing same and data read/write deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 9, 2010·2 cites·37 claims
- 2961US2025169209A1Image sensorDB HITEK CO LTD·Filed 2024·Application pending·0 cites
- 3060US8248906B2Ferroelectric hard disk systemHONG SEUNG-BUM·Filed 2007·Granted Aug 21, 2012·0 cites·3 claims
- 3158US7885169B2Electric field sensor having vertical structure, fabrication method thereof, and storage unit using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 8, 2011·0 cites·23 claims
- 3258US7885170B2Reading/writing head using electric field, data reading/writing apparatus including the same, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Feb 8, 2011·0 cites·18 claims
- 3358US2014103413A1Cmos image sensors with photogate structures and sensing transistors, operation methods thereof, and image processing systems including the sameJIN YOUNG GU·Filed 2013·Application pending·0 cites
- 3457US12336306B2SPAD structureDB HITEK CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·9 claims
- 3557US2024113149A1Backside illuminated image sensor and manufacturing method thereofDB HITEK CO LTD·Filed 2023·Application pending·0 cites
- 3656US9029785B2Method of fabricating microlens, and depth sensor including microlensPARK DOO CHEOL·Filed 2012·Granted May 12, 2015·0 cites·12 claims
- 3756US7687838B2Resistive memory device having array of probes and method of manufacturing the resistive memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 30, 2010·1 cites·6 claims
- 3856US2024120361A1Frontside illuminated image sensor and manufacturing method thereofDB HITEK CO LTD·Filed 2023·Application pending·0 cites
- 3955US7247968B2Two-axis micro-actuator with multidimensional actuation with large area stageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jul 24, 2007·8 cites·16 claims
- 4054US9103722B2Unit pixels, depth sensors and three-dimensional image sensors including the sameKO HYOUNG-SOO·Filed 2014·Granted Aug 11, 2015·0 cites·20 claims
- 4154US8107354B2Electric field read/write head, method of manufacturing the same, and information storage device comprising electric field read/write headKO HYOUNG-SOO·Filed 2008·Granted Jan 31, 2012·0 cites·19 claims
- 4253US9177987B2Binary CMOS image sensors, methods of operating same, and image processing systems including sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·0 cites·19 claims
- 4353US7287421B2Semiconductor probe with high resolution resistive tip and method of fabricating the sameSEOUL NAT UNIV IND FOUNDATION·Filed 2006·Granted Oct 30, 2007·0 cites·8 claims
- 4452US8901498B2Unit pixels, depth sensors and three-dimensional image sensors including the sameKO HYOUNG-SOO·Filed 2012·Granted Dec 2, 2014·0 cites·20 claims
- 4552US7733761B2Ferroelectric recording medium comprising anisotropic conduction layer, recording apparatus comprising the same, and recording method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 8, 2010·0 cites·19 claims
- 4651US8432001B2Electric field information reading head, electric field information writing/reading head and fabrication methods thereof and information storage device using the sameJUNG JU-HWAN·Filed 2007·Granted Apr 30, 2013·0 cites·22 claims
- 4751US7602202B2Semiconductor probe with high resolution resistive tip having doping control layer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 13, 2009·0 cites·5 claims
- 4851US2008180985A1Ferroelectric media structure for ferroelectric hard disc drive and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 4951US2025267377A1Digital pixel and image sensor including the sameDB HITEK CO LTD·Filed 2024·Application pending·0 cites
- 5050US2012294137A1Ferroelectric read headHONG SEUNG-BUM·Filed 2012·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →