Inventor · disambiguated record
Junichi Kakehata
Also filed as: KAKEHATA Junichi
2 granted patents·3 pending applications·1 citations·filing 2020–2025
33Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0178US12246398B2Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Mar 11, 2025·1 cites·8 claims
- 0262US2025205799A1Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bumpRESONAC CORP·Filed 2025·Application pending·0 cites
- 0350US12100923B2Connection structure and manufacturing method thereforSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·6 claims
- 0443US2024105653A1Solder paste, method for forming solder bumps, and method for producing member with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
- 0543US2024297135A1Solder paste, method for forming solder bumps, and method for manufacturing member provided with solder bumpsRESONAC CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →