Inventor · disambiguated record
Jun Gu Kang
Also filed as: KANG JUN-GU
16 granted patents·3 pending applications·2 citations·filing 2014–2022
85Inventor score
Top patents by PatentIndex Score
19 records- 0169US11049846B2Integrated circuit chip, method of manufacturing the integrated circuit chip, and integrated circuit package and display apparatus including the integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 29, 2021·1 cites·20 claims
- 0268US11222853B2Integrated circuit chip, integrated circuit package and display apparatus including the integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 11, 2022·1 cites·12 claims
- 0363US11569206B2Integrated circuit chip, method of manufacturing the integrated circuit chip, and integrated circuit package and display apparatus including the integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·8 claims
- 0462US11721640B2Integrated circuit chip, integrated circuit package and display apparatus including the integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·20 claims
- 0562US9466403B2Method for producing a flexible transparent electrode using cesium and a flexible transparent electrode produced therebyUNIV SUNGKYUNKWAN RES & BUS·Filed 2014·Granted Oct 11, 2016·0 cites·6 claims
- 0659US12501693B2Semiconductor device including different gate dielectric layers and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·17 claims
- 0756US12349437B2Method of fabricating a semiconductor device including source/drain contacts having different heights and different widthsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 1, 2025·0 cites·14 claims
- 0854US11990526B2Semiconductor device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0950US11114533B2Semiconductor device including contacts having different heights and different widthsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·19 claims
- 1043US12096190B2Apparatus and method for protecting dental patient hearing through noise reductionHEALING SOUND CO LTD·Filed 2020·Granted Sep 17, 2024·0 cites·16 claims
- 1143US10937882B2Semiconductor device including a field effect transistorSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·25 claims
- 1242US12017010B2Sound control system and method for dental treatmentHEALING SOUND CO LTD·Filed 2020·Granted Jun 25, 2024·0 cites·12 claims
- 1342US11121127B2Integrated circuit chips, integrated circuit packages including the integrated circuit chips, and display apparatuses including the integrated circuit chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·19 claims
- 1439US12293824B2System and method for establishing dental treatment environmentHEALING SOUND CO LTD·Filed 2020·Granted May 6, 2025·0 cites·8 claims
- 1539US2014353820A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1638US9299659B2Semiconductor devices including multiple interconnection structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 29, 2016·0 cites·5 claims
- 1736US2020303544A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 1835US10014407B2Semiconductor device having asymmetric active region and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 3, 2018·0 cites·20 claims
- 1924US2015279737A1Method for preparing silicide of a semiconductor device and a source/drain for use in the semiconductor deviceUNIV SUNGKYUNKWAN RES & BUS·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →