Inventor · disambiguated record
Junghoon Kang
Also filed as: KANG JUNGHOON
10 granted patents·44 pending applications·7 citations·filing 2015–2025
80Inventor score
Top patents by PatentIndex Score
54 records- 0191US11348807B2Semiconductor package, electronic apparatus and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 31, 2022·5 cites·11 claims
- 0274US12100668B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
- 0373US2024421099A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0470US2025140709A1Method of manufacturing semiconductor package, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0569US2025336900A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0666US2025286006A1Semiconductor package including an encapsulantSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0765US11837553B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 0865US9879775B2Shifting lever assemblySL CORP·Filed 2015·Granted Jan 30, 2018·2 cites·9 claims
- 0962US12230580B2Method of manufacturing semiconductor package, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1062US11798814B2Semiconductor package, electronic apparatus and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·10 claims
- 1160US12488996B2Semiconductor package having pad pattern including plastically deformed metal filmSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 1258US12374667B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1358US12341118B2Semiconductor package including an encapsulantSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1458US2025391806A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1558US2025372579A1Semiconductor package including multi-part connectionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025157902A1Semiconductor package including a conductive pillarSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1758US2025336832A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US2025380434A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1957US2025309012A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2057US2025253226A1Redistribution substrate, manufacturing method of the same, and a semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2157US2025253223A1Redistribution substrate, manufacturing method of the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2257US2025279386A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2357US2025309124A1Glass substrate, semiconductor package including glass substrate and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2457US2025167128A1Semiconductor package including a solder ballSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2556US2025079287A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2656US2025183146A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2756US2025157874A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2856US2025219000A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2955US2024204026A1Image sensor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3055US2024319454A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3155US2024213174A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3255US2025038122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3355US2025105235A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3454US2024429066A1Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3554US2025079320A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3654US2025022859A1Semiconductor package with glass core substrate and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3754US2025015062A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3854US2025062302A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3954US2025038115A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4050US2025149520A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4150US2025116810A1Semiconductor package with photonics chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4250US2025125312A1Semiconductor package including photonic chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4350US2025105231A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4450US2025149516A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4550US2025125321A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4649US2025102748A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4749US2025123447A1Semiconductor package with photonic chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4849US2025093594A1Semiconductor package including photonic integrated circuit chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4948US2025087651A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 5048US2024234268A9Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →