Inventor · disambiguated record
Jung-Kun Kang
Also filed as: KANG JUNG KUN
4 granted patents·5 pending applications·132 citations·filing 2004–2023
78Inventor score
Top patents by PatentIndex Score
9 records- 0192US7026709B2Stacked chip-packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 11, 2006·98 cites·14 claims
- 0282US7218006B2Multi-chip stack packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 15, 2007·19 cites·11 claims
- 0379US7417322B2Multi-chip module with embedded package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Aug 26, 2008·13 cites·18 claims
- 0455US2024140873A1Sintered body and method of manufacturing sintered bodySK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 0553US2024158304A1Sintered body and component part including sameSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 0652US2024140875A1Sintered body and parts including sameSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 0750US2020051793A1Ring-shaped element for etcher and method for etching substrate using the sameSKC SOLMICS CO LTD·Filed 2019·Application pending·0 cites
- 0847US7015065B2Manufacturing method of ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 21, 2006·2 cites·15 claims
- 0941US2020062654A1Boron carbide sintered body and etcher including the sameSKC SOLMICS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →