Inventor · disambiguated record
Junichi Kasai
Also filed as: KASAI JUNICHI
102 granted patents·8 pending applications·4,846 citations·filing 1983–2019
99Inventor score
Top patents by PatentIndex Score
110 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0298US6476503B1Semiconductor device having columnar electrode and method of manufacturing sameFUJITSU LTD·Filed 2000·Granted Nov 5, 2002·266 cites·11 claims
- 0397US4866776AAudio speaker system for automotive vehicleNISSAN MOTOR·Filed 1984·Granted Sep 12, 1989·149 cites·10 claims
- 0497US4641344AAudio equipmentNISSAN MOTOR·Filed 1985·Granted Feb 3, 1987·107 cites·25 claims
- 0596US6573121B2Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·126 cites·15 claims
- 0696US6376921B1Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 1998·Granted Apr 23, 2002·120 cites·11 claims
- 0795US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0895US5463253ASemiconductor device having a plurality of chipsFUJITSU LTD·Filed 1991·Granted Oct 31, 1995·210 cites·52 claims
- 0994US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 1094US4514599ASpeaker for automotive vehicle audio system having a vehicle panel serving as sound-amplifying mediumNISSAN MOTOR·Filed 1984·Granted Apr 30, 1985·114 cites·18 claims
- 1193US7285848B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2005·Granted Oct 23, 2007·19 cites·10 claims
- 1293US5801439ASemiconductor device and semiconductor device unit for a stack arrangementFUJITSU LTD·Filed 1997·Granted Sep 1, 1998·168 cites·20 claims
- 1392US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 1492US5519251ASemiconductor device and method of producing the sameFUJITSU LTD·Filed 1993·Granted May 21, 1996·123 cites·18 claims
- 1592US5508565ASemiconductor device having a plurality of chips having identical circuit arrangement sealed in packageFUJITSU LTD·Filed 1994·Granted Apr 16, 1996·150 cites·35 claims
- 1692US5451815ASemiconductor device with surface mount package adapted for vertical mountingFUJITSU LTD·Filed 1994·Granted Sep 19, 1995·134 cites·21 claims
- 1792US5129004AAutomotive multi-speaker audio system with different timing reproduction of audio soundNISSAN MOTOR·Filed 1989·Granted Jul 7, 1992·56 cites·5 claims
- 1891US7605457B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Oct 20, 2009·18 cites·8 claims
- 1990US5293072ASemiconductor device having spherical terminals attached to the lead frame embedded within the package bodyFUJITSU LTD·Filed 1993·Granted Mar 8, 1994·97 cites·6 claims
- 2089US4551849AVehicle panel speaker for automotive audio system utilizing part of a vehicle panel as a sound-producing mediumNISSAN MOTOR·Filed 1983·Granted Nov 5, 1985·58 cites·22 claims
- 2188US6379997B1Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameFUJITSU LTD·Filed 2000·Granted Apr 30, 2002·54 cites·11 claims
- 2287US5679978ASemiconductor device having resin gate hole through substrate for resin encapsulationFUJITSU LTD·Filed 1994·Granted Oct 21, 1997·96 cites·15 claims
- 2387US5530292ASemiconductor device having a plurality of chipsFUJITSU LTD·Filed 1992·Granted Jun 25, 1996·94 cites·7 claims
- 2486US7758675B2Gas treatment deviceISUZU MOTORS LTD·Filed 2005·Granted Jul 20, 2010·23 cites·18 claims
- 2586US7683473B2Semiconductor device, fabrication method therefor, and film fabrication methodSPANSION LLC·Filed 2006·Granted Mar 23, 2010·14 cites·29 claims
- 2686US6111306ASemiconductor device and method of producing the same and semiconductor device unit and method of producing the sameFUJITSU LTD·Filed 1997·Granted Aug 29, 2000·83 cites·12 claims
- 2786US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 2886US5521432ASemiconductor device having improved leads comprising palladium plated nickelFUJITSU LTD·Filed 1994·Granted May 28, 1996·84 cites·32 claims
- 2985US7884630B2IC carrie, IC socket and method for testing IC deviceMICRONICS JAPAN CO LTD·Filed 2005·Granted Feb 8, 2011·15 cites·20 claims
- 3085US5289181AVehicle alarm system for informing other vehicles of its own presenceNISSAN MOTOR·Filed 1991·Granted Feb 22, 1994·66 cites·16 claims
- 3185US4703502AStereo signal reproducing systemNISSAN MOTOR·Filed 1986·Granted Oct 27, 1987·51 cites·8 claims
- 3283US5637915ASemiconductor device affixed to an upper and a lower leadframeFUJITSU LTD·Filed 1996·Granted Jun 10, 1997·69 cites·14 claims
- 3383US4720867AWoofer system for an automotive audio system with a protecter thereforNISSAN MOTOR·Filed 1984·Granted Jan 19, 1988·38 cites·16 claims
- 3482US8039943B2Semiconductor device and manufacturing method thereforSPANSION LLC·Filed 2008·Granted Oct 18, 2011·11 cites·4 claims
- 3582US8030179B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Oct 4, 2011·8 cites·9 claims
- 3682US5760471ASemiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic packageFUJITSU LTD·Filed 1997·Granted Jun 2, 1998·71 cites·12 claims
- 3782US4953219AStereo signal reproducing system using reverb unitNISSAN MOTOR·Filed 1988·Granted Aug 28, 1990·46 cites·13 claims
- 3881US6104160AHousehold power supply system using electric vehicleNISSAN MOTOR·Filed 1998·Granted Aug 15, 2000·103 cites·17 claims
- 3981US5842628AWire bonding method, semiconductor device, capillary for wire bonding and ball bump forming methodFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·56 cites·8 claims
- 4080US5409866AProcess for manufacturing a semiconductor device affixed to an upper and a lower leadframeFUJITSU LTD·Filed 1992·Granted Apr 25, 1995·60 cites·24 claims
- 4177US7968990B2Semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2007·Granted Jun 28, 2011·7 cites·11 claims
- 4277US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 4377US5569625AProcess for manufacturing a plural stacked leadframe semiconductor deviceFUJITSU LTD·Filed 1994·Granted Oct 29, 1996·47 cites·8 claims
- 4477US4694497AAutomotive multi-speaker audio system with automatic echo-control featureNISSAN MOTOR·Filed 1986·Granted Sep 15, 1987·30 cites·10 claims
- 4576US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 4674US6495773B1Wire bonded device with ball-shaped bondsFUJITSU LTD·Filed 1998·Granted Dec 17, 2002·38 cites·4 claims
- 4774US5786985ASemiconductor device and semiconductor device unitFUJITSU LTD·Filed 1996·Granted Jul 28, 1998·47 cites·22 claims
- 4874US5424251AMethod of producing semiconductor device having radiation part made of resin containing insulator powdersFUJITSU LTD·Filed 1993·Granted Jun 13, 1995·41 cites·9 claims
- 4973US6207477B1Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Mar 27, 2001·37 cites·9 claims
- 5071US5747874ASemiconductor device, base member for semiconductor device and semiconductor device unitFUJITSU LTD·Filed 1995·Granted May 5, 1998·37 cites·27 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →